ADLINK Launches First COM Express Module Featuring Intel CoreTM, Xeon, and Celeron 6000 Processors

Tiera Oliver

August 9, 2021

Boardcon Releases New SBC for AIoT

Chad Cox

August 6, 2021

Why Metrology is the Key to Intel's "Angstrom Era"

Joe Cestari

August 6, 2021

Portwell Releases PCOM-BA02GL, a New COM Express Type 10 Mini Module

Chad Cox

August 6, 2021

NVIDIA Maintains Position in 2020 Market for AI Processors for Cloud and Data Center

Tiera Oliver

August 6, 2021

congatec Launches 20 New Computer-on-Modules with 11th Gen Intel Core Processors

Tiera Oliver

August 5, 2021

MediaTek’s Kompanio 1300T SoC Platform Ups the Tablet Performance Experience

Rich Nass

August 4, 2021

SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications

SmartDV? Technologies

August 3, 2021

Getting more for less: designing smarter Edge AI

Tony King-Smith

August 3, 2021

Bringing Down the Duration of Hardware Design Life Cycle for Compact High Performing Architecture

Saumitra Jagdale

August 3, 2021

Imagination opens Cambridge office

August 3, 2021

Dev Kit Weekly: Xilinx Kria KV260 Vision AI Starter Kit

Brandon Lewis

July 30, 2021

The KV260 Vision AI Starter Kit is based on Xilinx’s Kria K26 system on module, which is a … wait, wait, wait. A system on module from Xilinx?

First Single-Chip Network Synchronization Solution Provides Precise Timing for 5G Radio Access Equipment

Taryn Engmark

July 30, 2021

TFT LCD Parallel Interface Comparison: MCU vs RGB

Shenzhen Topway Technology Co., Ltd

July 30, 2021

u-blox Wins Chinese Court Ruling Against Techtotop in Patent and Copyright Infringement Suits

Taryn Engmark

July 29, 2021

OKdo Renew Offers Customers the Opportunity to Return Selected Raspberry Pi Boards for a Reward

Taryn Engmark

July 29, 2021

The OMNI-2155-CML: Tapping into Next Generation Performance

AAEON Technology Inc.

July 27, 2021

Modular Interfacing Ecosystem Provides Wide Range of Options for Dynamic Applications

Saumitra Jagdale

July 27, 2021

TQ Develops New Embedded Module Based on NXP

TQ-Group

July 26, 2021

u-blox Introduces Dual-Output Automotive Dead Reckoning Modules Qualified for Operation Up to 105 °C

Tiera Oliver

July 23, 2021

Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution

Taryn Engmark

July 22, 2021

Product of the Week: NVIDIA QUADRO RTX 6000

Embedded Computing Design Staff

July 21, 2021

Microchip Announces Production Shipments of NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters

Tiera Oliver

July 21, 2021

Renesas Launches R-Car Gen3e for Automotive Infotainment, Cockpit, and Digital Cluster Systems

Tiera Oliver

July 20, 2021