AI & Machine Learning
AI Playtime is Over: It is Time to Get Serious
March 4, 2026
Well, distinguished members of the (embedded industry) jury, I’m just a poor country lawyer (editor), and I don’t go in for all that newfangled LLM stuff that the big folks (you know who they are) are all on about. But the way I see it, as we get into embedded world, the time is about here to acknowledge that we’re doing serious work in the embedded industry, and we should probably put away the toys.
HPC/Datacenters
PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 4, 2026
In modern data center power architectures, a quarter brick (QB) solution plays a critical role by converting intermediate bus voltages to regulated outputs that power advanced processors. To meet stringent performance and reliability requirements, integrating a digital power system manager (PSM) has become essential.
HPC/Datacenters
BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 4, 2026
There’s a lot of talk about moving processing to the edge and of Edge AI taking over much of what servers used to do, but one company is creating a solution for bringing servers to the edge.
IoT
The Road to embedded world: Infineon Accelerates Edge AI and Power Design with PSOC MCUs
March 4, 2026
During embedded world Germany (March 10–12, Nuremberg), Infineon Technologies will showcase its latest PSOC microcontrollers, tools, and DEEPCRAFT AI Suite. Stop by Hall 4A, Booth 138 to explore new solutions across many applications and learn ways to accelerate your time-to-market on designs and AI/ML models.
AI & Machine Learning
From Data to Drain: How AI Is Devouring the World’s Electricity
March 4, 2026
America’s data centers managed to keep their electricity use surprisingly steady from 2005 to 2017, with rather small annual increments contained via constant improvement in electronics. Then, around 2017, AI arrived forcefully and disrupted that stability.
IoT
The Road to embedded world: APLEX Debuts NVIDIA Jetson-Powered Edge AI Systems and Stainless-Steel HMIs for Industrial and Food Processing Applications
March 4, 2026
APLEX Technology Inc. will be in Booth 3-533 at embedded world Germany exhibiting its innovations designed for harsh environments in industries such as oil and gas, food and beverage, maritime, and more. APLEX provides factory automation and food and beverage automation solutions.
Processing
The Road to embedded world: Join Trenz to Discover Next-Gen FPGA and Edge AI Hardware
March 3, 2026
Trenz will be bringing its lineup of brand-new hardware to embedded world Germany. At its booth, 5-140, Trenz will showcase ten new products (seven AMD-based and three Altera-based solutions) covering everything from budget friendly FPGA platforms and high-IO designs to RF signal processing and next-generation edge AI.
Networking & 5G
The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 2, 2026
Bluetooth is often seen as a “plug-and-play” technology for embedded systems. Drop in a module, connect a few traces, and you’re done—right? Not quite, and especially with Channel Sounding. Behind the scenes, antenna design can make or break your product’s performance. Poor decisions lead to reduced range, higher power consumption, and even failed certifications.
IoT
The Road to embedded world: Sealevel Demonstrates Edge AI and Industrial I/O Solutions for Harsh Environments
March 2, 2026
At embedded world Germany 2026, Sealevel will showcase its embedded computing and industrial I/O platforms ideal for power connected systems across automation, edge intelligence, machine control, vision systems, and high-performance data applications.
Uncategorized
embedded world Germany 2026 Best-in-Show: Nominees
March 2, 2026
The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the following categories:
Debug & Test
Mouser Product of the Week: Analog Devices’ EV-ADF4030SD1Z Evaluation Board
March 2, 2026
Evaluating, testing, and prototyping are critical and widely recognized processes in the development of various applications. Applications such as 5G timing transport, high-precision synchronization, automatic test equipment (ATE) pin electronics, and phased array radar applications can benefit from evaluation boards combining both hardware and software for testing.
IoT
The Road to embedded world: ADLINK Highlights Scalable Edge AI Computing from COM Modules to Multi-GPU Servers
February 27, 2026
ADLINK Technology Inc. will exhibit its edge AI portfolio at embedded world Germany (Hall 3, Booth 3-147) under the theme “Leading Edge AI Computing.” ADLINK’s highlights will include a unified edge AI architecture in a range of form factors such as COM modules and industrial motherboards to embedded systems, workstation-class GPU servers, and modular MXM and PEG GPU acceleration.
Processing
The Road to embedded world: congatec “Goes Bigger” With Application-Ready Platforms
February 26, 2026
During embedded world Germany, congatec will exhibit its latest innovations in application-ready platforms while located at Hall 3, Booth 241. congatec is "going bigger" following an investment in JUMPtec (the former module business of Kontron AG) that expands its portfolio to even more modules, application examples, and services.
Processing
Altera’s Agilex FPGAs Power Robotics, Autonomous Systems, and Edge AI at embedded world Germany
March 4, 2026
Altera will be in Hall 5, Booth 5-329 at embedded world Germany where it is planning to highlight how its Agilex FPGAs are engineered to meet the real-time demands of physical AI systems. Altera’s adaptable FPGA platforms deliver scalable acceleration from multi-sensor ingestion and AI inference to real-time control. Booth demonstrations will show how FPGAs power multi-sensor processing, AI-driven perception, and low-latency decision-making at the edge.
Industrial
Akasa AK-CC7409BP01 Offers 125W Cooling in a 29.5mm Low-Profile Design for Intel LGA1851 and LGA1700
March 4, 2026
Akasa introduced the AK-CC7409BP01, a low-profile CPU cooler designed for thermally demanding, space-constrained environments. It is compatible with Intel LGA1851 and LGA1700 sockets and has an integrated copper vapor chamber heatsink and a UL-certified side blower fan delivering consistent cooling at 29.5mm in height. It is suited for 1U servers, SFF systems, and other applications where vertical clearance is limited.
Multimedia
Embedded Executive: embedded world in Germany is Nearly Here | Axel Sikora
March 4, 2026
T-minus six days for embedded world in Nuremberg. If you’ve been in the embedded space for any amount of time, you’re likely aware of embedded world, which is the annual global meeting place for the industry.
On this week’s Embedded Executives podcast, I was able to corral Axel Sikora, the Chairman of the conference’s technical committee. We walked through some of the highlights of the upcoming event.
Analog & Power
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Dynamic CPU Power Management with cpufreq and schedutil
February 23, 2026
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Embedded Executive: Energy Harvesting Replaces Batteries/Traditional Power Sources | WePower Technologies
January 28, 2026
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Mouser Product of the Week: Analog Devices’ EVAL-LTC7899-AZ Evaluation Board
January 12, 2026
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Optimizing LDO Headroom Control with a Current Referenced Switching Regulator Design—Part 1: Noise Sources, Impact, and Strategies
December 02, 2025
Automotive
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Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
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New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
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Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
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SOAFEE Blueprint: Enabling AI-Native, Offline-Resilient Vehicle Software with mimik
January 15, 2026
Consumer
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Create reliable, power efficient and safe home appliance designs with a PSOC™ Control C3 and CoolGaN™ solution
February 18, 2026
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Tear Down: Google Pixel Watch 4
February 03, 2026
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TDK Adds SmartMotion for Smart Glasses to its Custom Sensing Solutions for AI Glasses and Augmented Reality
September 30, 2025
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Arm Delivers Personal AI on Consumer Devices with New Lumex CSS Platform
September 10, 2025
Industrial
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NVIDIA Sponsors New Humanoid Robot Pavilion at Automate 2026
February 27, 2026
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Embedded Executive: Bluetooth and Industrial Are Joining Forces | Blecon
February 25, 2026
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The Road to embedded world: AntennaWare Launches First Low-Profile Alternative to Monopole Antennas
February 18, 2026
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Energy Management Is Harnessed Thanks To iAMT On the Right Embedded Computing Platform
February 17, 2026
IoT
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Embedded Executive: embedded world in Germany is Nearly Here | Axel Sikora
March 04, 2026
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The Road to embedded world: APLEX Debuts NVIDIA Jetson-Powered Edge AI Systems and Stainless-Steel HMIs for Industrial and Food Processing Applications
March 04, 2026
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The Road to embedded world: Sealevel Demonstrates Edge AI and Industrial I/O Solutions for Harsh Environments
March 02, 2026
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embedded world Germany: NEXCOM Introduces APPC C21-01 Fanless Panel PCs to Bridge Industrial Automation and Edge AI
February 27, 2026
Storage
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The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos
February 24, 2026
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The Road to embedded world: BIWIN ePoP5X Combines LPDDR5X and eMMC for Space-Constrained AI Devices
February 22, 2026
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The Road to embedded world: BIWIN Highlights TAU208 UFS 3.1 Automotive Storage
February 13, 2026
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MEMPHIS Electronic Showcases Long-Term Memory Availability Planning at embedded world Germany
February 11, 2026
Open Source
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The Zephyr Project Grows Membership, Highlights Security and Resilience at embedded world 2026
February 10, 2026
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Mouser Product of the Week: NXP Semiconductors' FRDM-MCXE31B Development Board
February 09, 2026
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At embedded world 2026, Linutronix to Present IGLOS Secure Industrial Grade Linux OS
February 04, 2026
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Create a Cost-Effective HMI With LVGL (and Some Help From Renesas)
January 26, 2026
Processing
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The Road to embedded world: Join Trenz to Discover Next-Gen FPGA and Edge AI Hardware
March 03, 2026
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The Road to embedded world: congatec “Goes Bigger” With Application-Ready Platforms
February 26, 2026
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The Road to embedded world: EMASS ECS-DoT SoC Powers Real-Time Edge Inference
February 20, 2026
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Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 FPGA Module at embedded world’ 26, Germany
February 18, 2026