IoT
IndySoft Launches IndySoft Scales Mobile Calibration App for Faster Field Workflows
April 22, 2026
IndySoft announced its mobile calibration app, IndySoft Scales, that is touch-optimized, voice-enabled, and offline-first. The platform handles such industry challenges as delayed data from the field, inconsistent documentation quality, manual tolerance calculations, and paper-based workflows. It is designed to provide technicians with an easier platform than a traditional laptop offers in the field.
Debug & Test
Teradyne Acquires TestInsight to Expand ATE Platforms for AI and Data Center Testing
April 22, 2026
Teradyne, Inc. has acquired TestInsight with a goal of accelerating the development of test solutions on Teradyne platforms. The acquisition enhances Teradyne’s capability of supporting customer design-in activities and accelerates time to market for AI and data centers.
Healthcare
Wincomm’s New Medical All-in-One PCs Feature IP65 Front Panel, Built-In Power Supply, and “Clean Me” Mode
February 24, 2026
Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
Multimedia
embedded world 2026 Podcast with TeleCANesis
April 22, 2026
Ken Briodagh, Editor in Chief at Embedded Computing Design, interviews Jonathan Hacker from TeleCANesis at embedded world!
Debug & Test
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Siemens Veloce proFPGA CS AI Chip Delivers Verification to Trillion‑Cycle Scale
April 13, 2026
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Mouser Product of the Week: Analog Devices’ ADPA1112-EVALZ Evaluation Board
April 06, 2026
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NI Connect 2026 to Highlight AI-Driven Productivity
March 24, 2026
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The Road from embedded world: TASKING Showcased Integrated Compile-Debug-Test Workflow for Safety-Critical Embedded Systems
March 16, 2026
Healthcare
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Wincomm’s New Medical All-in-One PCs Feature IP65 Front Panel, Built-In Power Supply, and “Clean Me” Mode
February 24, 2026
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Empowering Real-Time Eye Health Diagnostics with ASUS IoT PE4000G Edge AI Computers
February 23, 2026
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Axiomtek’s mBOX603 Delivers High-Performance Medical Imaging and AI-Assisted Diagnostics
December 10, 2025
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Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
Industrial
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Microelectronics US 2026: VisAbility Solutions SmartSeeker Boosts Semiconductor Productivity with Intelligent Asset Visibility
April 20, 2026
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Register for Hardware Pioneers Max 2026 at Excel London and Save 20% on VIP Tickets
April 20, 2026
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Cirrus Logic Introduces New Industrial Imaging Products for High-Precision Scan Applications
April 16, 2026
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AAEON CEXD-INTRBL Powered by Intel Core Ultra X7 Targets Next-Gen Robotics Applications
April 16, 2026
IoT
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eInfochips Launches EIC PROPEL IoT Platform on Microsoft Marketplace for Seamless Azure Integration
April 14, 2026
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From COM Express to COM-HPC: Why High-Performance Embedded Systems Must Evolve
April 14, 2026
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Nanomade Debuts Ultra-Sensitive Sensors
April 10, 2026
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MSI IPC to Demo Smart Retail, Machine Vision, and Edge AI at Japan IT Week Spring 2026
April 03, 2026
Storage
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Embedded Executive: We Are In a Memory Crisis | Everspin
April 01, 2026
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embedded world 2026 Podcast with Rambus
March 27, 2026
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Accelerate AI Workloads with Rambus HBM4E Memory Controller
March 05, 2026
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Greenliant to Demo High-Endurance Industrial SSD Portfolio at embedded world Germany 2026
March 03, 2026
Processing
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Tria Technologies Unveils COM-HPC Computer-on-Module Powered by Intel Core Ultra Processors with 180 TOPS AI Performance
April 17, 2026
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embedded world 2026 Podcast with onsemi
April 16, 2026
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Rapidus Unveils Analysis Center and its Rapidus Chiplet Solutions Hub for Next-Gen Semiconductor Manufacturing
April 14, 2026
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embedded world 2026 Podcast with SCI Semiconductor
April 10, 2026
Security
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Microchip Secures IEC 62443-4-1 ML2 Certification, Strengthening Industrial Cybersecurity
April 10, 2026
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Axelera AI Integrates Kudelski Secure Enclave into Europa Edge AI Platform
March 27, 2026
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The EU Cyber Resilience Act & Industrial Power Conversion in Data Centers
March 26, 2026
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Embedded Executive: Once Again, You MUST Implement Security | Thistle Technologies
March 18, 2026
HPC/Datacenters
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PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026
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Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting
December 17, 2025