Multimedia
AI & Machine Learning
- DSP Concepts Announces Early Access Availability of AI-Optimized Audio Framework for Cadence Tensilica HiFi 5 DSP
- Accelerate AI Applications Using VITIS AI on Xilinx ZynqMP UltraScale+ FPGA
- The New Chips on the Block - Part 1
- Take Shopping to New Heights with AIoT at the Edge
Automotive
- Infineon Introduces Industry’s First AEC-Q103 Qualified XENSIV MEMS Microphone for Automotive Applications
- Automotive-Grade MEMS Mics Raise the Standard for In-Cabin Audio
- 3 Reasons We Haven’t Reached Level 5 AV Deployment
- EV Charging Design Specialist Versinetic Partners with EV Charging Software Provider Saascharge
Debug & Test
- Global Certification Forum Validates IMS Test Cases from Rohde & Schwarz
- SEGGER J-Link, Flasher, and Embedded Studio Now Support Raspberry Pi RP2040
- PractiTest's New Update for Software Testing Management to Improve Quality and Visibility
- Parasoft Showcases Integrated Automated Testing Solution for CI/CD Workflow at embedded world 2021
Open Source
- STMicroelectronics Releases B-L462E-CELL1 Discovery Kit
- AWS and Klika Tech Introduce New Model for IIoT Anomaly Detection
- Imperas Donates Latest RV32/64K Crypto (scalar) Architectural Validation Test Suites to the RISC-V Verification Ecosystem
- Lantronix Releases the Mobile Hardware Development Kit
Security
- Product of the Week: wolfSSL wolfSentry
- Cypress Extends Licensing of SEGGER's Embedded File System emFile to Include PSoC 6
- Rohde & Schwarz Announces New IEEE 802.3ch MultiGBASE-T1 Automotive Ethernet Standard Compliance Test Solution
- Three Layers of Advanced Security Features from Flexxon with Its X-Mask Technology
Software & OS
- IAR Systems appoints Kazuhisa Harabe as new Country Manager for Japan
- Percepio and Lauterbach Announce Collaboration for Faster Debugging
- Embedded Systems: The Big Picture
- Labcenter Introduces Proteus v8.12 with Enhanced Support for Differential Pair nets and Multi-Board Project Support