IoT
"From Edge to Action": ARBOR Technology Highlights COM-HPC and Edge AI at embedded world 2026
February 4, 2026
ARBOR Technology is expected to demonstrate its innovations at embedded world Germany from March 10–12, 2026 in Nuremberg, Germany. ARBOR Technology’s Booth, No. 3-364, will be centered on the theme of “From Edge to Action.” Highlighted at the booth will be its COM-HPC modules and edge AI computing solutions ideal for data-driven actions across medicine and intelligent transportation applications. Booth demonstrations will include embedded products powered by Intel, NVIDIA, and AMD.
Multimedia
When AI Gets Physical & The Impact of AI on Engineering
February 5, 2026
In this episode of Embedded Insiders, Krishna Rangasayee, Founder and CEO of SiMa.ai, joins the podcast to discuss advancements surrounding physical AI at the edge. His company is focused on a software-centric Physical AI hardware and software platform, and we dive into some of the trends and challenges in this space.
Automotive
-
New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
-
Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
-
SOAFEE Blueprint: Enabling AI-Native, Offline-Resilient Vehicle Software with mimik
January 15, 2026
-
Ironwood Electronics 22×22 Array BGA Package Targets High-Reliability Automotive PCBs
January 12, 2026
Healthcare
-
Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
-
Overcome Wi-Fi connectivity challenges for medical devices in hospitals and medical institutions
October 13, 2025
-
“The Good Invasion of Robots”
September 15, 2025
-
Hospitals Adopt Wincomm WMP-22P for EEG-Video Synchronized Monitoring
August 22, 2025
Industrial
-
TouchNetix’s AX24A Touch and Force Controller Targets Automotive, Industrial, and Gaming Interfaces
February 02, 2026
-
DFI Industrial Fanless System Brings Intel Power to Factory Automation
January 29, 2026
-
Vodafone IoT and Skylo Enable Seamless Cellular-to-Satellite NB-IoT Connectivity
January 28, 2026
-
Stay Competitive in Manufacturing with Customer Satisfaction
January 26, 2026
Networking & 5G
-
Embedded Executive: Everything You Need To Know About Wi-Fi | Infineon
January 07, 2026
-
Deploy Channel Sounding In Your Bluetooth Devices
December 16, 2025
-
Taoglas Expands Low-Cost, Compact Chip Antenna Range for Wi-Fi 6/7, UWB, and ISM Applications
December 02, 2025
-
Mouser Product of the Week: STMicroelectronics ST67W Wi-Fi 6/BLUETOOTH 5.4/Thread Modules
December 01, 2025
Open Source
-
Create a Cost-Effective HMI With LVGL (and Some Help From Renesas)
January 26, 2026
-
RISC-V International: Becoming ISO and The Future of Open Computing
January 22, 2026
-
Development Kits Decoded: Bridging OEMS Needs and Supplier Solutions
January 15, 2026
-
Embedded Executive: RISC-V Works Great At Low Power Levels, Too | Upbeat Technology
November 19, 2025
Processing
-
Variscite Expands SoM Portfolio with SMARC-Based i.MX 8M Plus Module for Secure Edge AI
February 02, 2026
-
IBASE IB96W SBC Targets Industrial Edge Applications with Intel Core i7-1370PRE
January 28, 2026
-
DATA MODUL to Showcase eDM-SBC-iMX95 Compact SBC at embedded world 2026
January 27, 2026
-
Axiomtek IMB711 Enables Mission-Crtical CT, MRI, and AI Workloads Leveraging Intel Xeon
January 22, 2026
Security
-
Embedded Executive: The Latest On the Chips Act | PQSecure
February 04, 2026
-
PX5 NET Gains TÜV Approval, Enabling Faster Certification of Safety-Critical Embedded Applications
January 22, 2026
-
New RunSafe Security Report: Engineering Leaders Brace for Rising Cyber Risks in Embedded AI
December 11, 2025
-
Compliance with the EU Cyber Resilience Act: A Comprehensive Approach for OEMs
November 14, 2025
Software & OS
-
DevTalk with Rich and Vin: UI Design
January 09, 2026
-
Engineering Real-Time: Lessons Learned While Chasing Determinism Part 4
December 11, 2025
-
Secure Boot and the Manufacturing Chain: Implementation and Impact
December 09, 2025
-
Engineering Real-Time: Lessons Learned While Chasing Determinism Part 3
December 03, 2025