Security
The Road to embedded world: PQShield Advances Post-Quantum Cryptography
February 17, 2026
PQShield (Booth 4-378) will attend embedded world Germany to showcase its post-quantum cryptography for embedded hardware including its quantum-safe secure boot, side-channel protection against physical attack, and PQC-secure TLS.
Industrial
Energy Management Is Harnessed Thanks To iAMT On the Right Embedded Computing Platform
February 17, 2026
Energy management, in the context of digital energy and the smart grid, refers to the monitoring, control, and optimization of energy generation, distribution, and consumption using (digital) data-driven and automated technologies. It extends beyond traditional analog/power system operation by integrating real-time measurements, advanced analytics, and intelligent control across the entire system, whether that system is within a box, within a building, or within a city. And it includes the complete chain from generation to consumption.
AI & Machine Learning
Taiwan Excellence Showcases AI Breakthroughs at embedded world 2026
February 17, 2026
As the largest foreign exhibitor at embedded world 2026 in Nuremberg from March 10 to 12, Taiwan will present a broad range of AI-driven innovations in electronics and computing. The show opens on Tuesday, March 10, with the Taiwan Excellence Product Launch Event, where leading Taiwanese technology companies will introduce next-generation AI applications designed for embedded and edge environments.
IoT
Choosing the Right Silicon for Edge AI: How Intel, AMD, NVIDIA, and Arm Are Shaping the Next Generation of Distributed Computing
February 17, 2026
Edge computing devices, from retail cameras to factory controllers and logistics endpoints, are rapidly becoming frontline AI systems. The modern edge stack blends CPUs, GPUs, and increasingly NPUs (neural processing units) to deliver low‑latency, on‑device intelligence. This article compares how Intel, AMD, NVIDIA, and Arm pursue edge AI differently and offers CIOs a practical decision framework to align silicon, thermals, and software ecosystems with real workloads and operating constraints.
Storage
The Road to embedded world: BIWIN Highlights TAU208 UFS 3.1 Automotive Storage
February 13, 2026
During its stay at embedded world Germany 2026, BIWIN Storage Technology Co., Ltd. (BIWIN) will be in Booth 1-140 demonstrating its BIWIN TAU208 UFS 3.1 automotive-grade storage designed for performance and reliability in harsh environments.
IoT
The Road to embedded world: Discover Vecow’s AI PC Revolution and Robotics Supercomputers
February 12, 2026
Vecow will attend embedded world Germany and invites visitors to Hall 3, Stand 3-259 to see its Edge AI demonstrations under the theme "Powering the Future of Intelligence". On display will be high-performing AI engines driven by the latest Intel, NVIDIA, and Qualcomm technology.
IoT
The Road to embedded world: MiTAC Showcases Scalable Industrial Edge Computing Solutions for AI Workloads
February 11, 2026
MiTAC Digital Technology (MDT) Corp. will exhibit its portfolio of industrial Edge computing products engineered to support modern data processing and AI workloads during embedded world Germany between March 10–12, 2026. MiTAC’s booth location will be Hall 3 Stand 3-358 where the company will demonstrate the way its solutions are designed to enable flexibility in how software and system architectures are implemented.
Processing
The Road to embedded world: Enclustra Highlights Andromeda RFSoC, AMD Versal SoC, and Edge AI Solutions
February 10, 2026
Enclustra will be located at Booth 3A-331 during this year's embedded world Germany where it will highlight its next-generation FPGA and SoC innovations. The booth will host an interactive Enclustra Product Wall, highlighting the latest Andromeda RFSoC and SoC modules, including the powerful Andromeda XRU50, the newly introduced XRU30 for scalable, high-performance RF applications, and the Andromeda XVE70 based on AMD Versal SoC for advanced edge AI and signal processing.
Open Source
Mouser Product of the Week: NXP Semiconductors' FRDM-MCXE31B Development Board
February 9, 2026
Rapid prototyping is a critical step in the development of modern motor control, industrial automation, and general-purpose embedded systems. Embedded engineers, software developers, and hardware designers must ensure products are ready for deployment, with the support of powerful and flexible testing and implementation solutions.
Automotive
From Design to Verification: Best Practices for Automotive Functional Safety Certification
February 5, 2026
Ever wondered what goes into getting safety certification for electronic devices used in automobiles? In modern vehicles, even a minor design lapse can lead to catastrophic consequences. This is where functional safety becomes critical.
Processing
Semiconductor M&A Heats Up Early in 2026: More to Come?
February 4, 2026
The semiconductor industry is starting to look like it’s due for big changes.
Security
STM32 OTA Firmware Update
February 4, 2026
The article explains how firmware updates work on STM32 microcontrollers, starting with the built-in STM32 bootloader (used for factory or recovery flashing via UART/USB) and then detailing in-application programming (IAP) techniques for updating firmware while the device is running. It covers common update strategies such as using a custom bootloader or dual-bank flash to safely download, store, and apply new firmware images, and highlights flash memory organization and challenges like preventing corruption during updates.
Automotive
New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 4, 2026
Embedded audio systems increasingly require more sophisticated audio capabilities, both in smaller, denser, feature-rich devices where EMI, power, and space are critical constraints, and in large devices where audio data streams must be reliably transmitted over multi-meter wire lengths.
Debug & Test
embedded world Germany 2026: TASKING Toolchain Brings AI-Driven Compile, Debug, and Test for Safety-Critical Applications
February 12, 2026
Munich, Germany. TASKING acquired LDRA last year, and on its first anniversary of the procurement, has announced its TASKING toolchain. By effectively integrating LDRA and TASKING competences, the toolchain delivers complete end-to-end compile, debug, and test capabilities. With the help of AI, the solution fast-tracks the development of real-time embedded systems with built-in safety and security in automotive, aerospace and defense, industrial, and robotics.
AI & Machine Learning
Circuit Mind Study Finds AI Automation Driving Measurable Gains in Circuit Design Efficiency
February 12, 2026
Circuit Mind published independent, data-supported research revealing AI-powered automation is driving measurable gains in electronics design workflows. Contained within is a peer-reviewed assessment by Los Alamos National Laboratory, as well as commercial engineering teams utilizing AI to speed up circuit architecture innovation, schematic generation, and initial verification.
Software & OS
Multimedia
DevTalk with Rich and Vin: The Vital Connection Between Industry and Academia
February 17, 2026
Does the academic world do a good job at getting its students ready to work in the real world? Is it even possible to do that now, given the pace AI is forcing industry to move at, and knowing that academia doesn’t typically move that quickly?
Analog & Power
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Mouser Product of the Week: Analog Devices’ EVAL-LTC7899-AZ Evaluation Board
January 12, 2026
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Optimizing LDO Headroom Control with a Current Referenced Switching Regulator Design—Part 1: Noise Sources, Impact, and Strategies
December 02, 2025
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Product of the Week: Bicker Elektronik GmbH DC401W DC-ATX Power Supply
December 01, 2025
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iDEAL’s SuperQ MOSFET Delivers 800A SCWC, Redefining Safety in 72V+ Battery Systems
November 25, 2025
AI & Machine Learning
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Taiwan Excellence Showcases AI Breakthroughs at embedded world 2026
February 17, 2026
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Circuit Mind Study Finds AI Automation Driving Measurable Gains in Circuit Design Efficiency
February 12, 2026
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Embedded Executive: A Fresh Approach to AI | VSORA
February 11, 2026
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When AI Gets Physical & The Impact of AI on Engineering
February 05, 2026
Debug & Test
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GÖPEL electronic to Highlight Video Dragon and FlashFOX at embedded world Germany 2026
January 28, 2026
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PLS to Unveil UDE 2026 Universal Debug Engine at embedded world Germany 2026
January 21, 2026
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Emerson Broadens Access to Modular Test Platform with Cost-Effective Automation Hardware
January 20, 2026
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Solid Sands to Acquire Plum Hall
December 03, 2025
Healthcare
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Wincomm Brings Edge AI and Intel Core Ultra to Healthcare
November 21, 2025
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Overcome Wi-Fi connectivity challenges for medical devices in hospitals and medical institutions
October 13, 2025
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“The Good Invasion of Robots”
September 15, 2025
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Hospitals Adopt Wincomm WMP-22P for EEG-Video Synchronized Monitoring
August 22, 2025
IoT
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Industry Acquisitions, Connectivity, IoT, AI, and Embedded Trends For 2026
February 12, 2026
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The Road to embedded world: Discover Vecow’s AI PC Revolution and Robotics Supercomputers
February 12, 2026
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Virscient to Present Cutting-Edge Wireless Connectivity and Audio Technologies at embedded world Germany
February 11, 2026
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The Road to embedded world: MiTAC Showcases Scalable Industrial Edge Computing Solutions for AI Workloads
February 11, 2026
Open Source
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Mouser Product of the Week: NXP Semiconductors' FRDM-MCXE31B Development Board
February 09, 2026
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At embedded world 2026, Linutronix to Present IGLOS Secure Industrial Grade Linux OS
February 04, 2026
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Create a Cost-Effective HMI With LVGL (and Some Help From Renesas)
January 26, 2026
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RISC-V International: Becoming ISO and The Future of Open Computing
January 22, 2026
Processing
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Semiconductor M&A Heats Up Early in 2026: More to Come?
February 04, 2026
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Variscite Expands SoM Portfolio with SMARC-Based i.MX 8M Plus Module for Secure Edge AI
February 02, 2026
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IBASE IB96W SBC Targets Industrial Edge Applications with Intel Core i7-1370PRE
January 28, 2026
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DATA MODUL to Showcase eDM-SBC-iMX95 Compact SBC at embedded world 2026
January 27, 2026
HPC/Datacenters
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A Comprehensive Digital Twin Environment and Semiconductor Lifecycle Management Can Ensure Reliable Data-Center Operations
November 24, 2025
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The Power Problem Behind AI Data Center Performance
November 11, 2025
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NODKA Leverages Intel Power for Industrial HPC Applications
November 06, 2025
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Meeting the Demanding Energy Needs of AI Servers with Advanced Technology
October 23, 2025