Networking & 5G
Networking & 5G
Analog & Power
Industrial
Storage
Security
AI & Machine Learning
Stochastic Computing Architecture for Efficient Use of TinyML
January 11, 2022
Software & OS
TwinCAT/BSD Hypervisor Provides Efficient Engineering and Execution of Virtual Machines
January 13, 2022
Multimedia
Entering the Metaverse and How Shortages Impact Engineers on the Street
January 20, 2022
This week, the Insiders recap a COVID-era Consumer Electronics Show and debate one of CES’s hottest topics: the metaverse. Broadly speaking, the metaverse could be an in-between where physical reality and virtual reality collide, or it could be an entirely digital alternate universe.
AI & Machine Learning
- Google Presents Predicting Text Readability Through Reader Interactions
- CEVA Announces NeuPro-M Heterogeneous and Secure Processor Architecture
- Avalanche Computing Launches Low-Code AI Tool at CES 2022
- MultiTech and Megh Computing Collaborate to Provide Video Analytics Over Private LTE
Automotive
- Ambarella Launches AI Domain Controller SoC Family for Single-Chip Multi-Sensor Perception, Fusion, and Path Planning in ADAS to L4 Autonomous Vehicles
- MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface
- Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems
- Toshiba Launches High Performance Ethernet PCIe Bridge IC
Consumer
- Veea’s Smart Hub Adds Wi-Fi 6 Mesh Router Technology
- Guide Sensmart Releases Consumer Grade Autofocus Thermal Camera for Smartphones
- CY Vision Launches AR Technology for Windshields for Next-Generation Vehicles at CES 2022
- GAF Energy Announces Timberline Solar: Combines Solar and Traditional Roofing Installation and Materials
Debug & Test
- Solid Sands' SuperTest Extended by 3000 New Tests and Support for C++20
- Embracing a More Advanced Application Security Framework
- Rohde & Schwarz 5G mmWave Small Cell Test Solution Validated by Qualcomm Technologies, Inc.
- Traditional Development Processes Aren't Enough When Developing IoT Devices
Industrial
- TwinCAT 3 Directly Integrates OPC UA Pub/Sub
- Khronos and EMVA Issue Call for Participation for New Camera API Working Group
- Collaboration in the Workplace: How a New Generation of Cobots Is Improving the Nature of Manual Work
- Landing AI Welcomes Machine Vision Expert to Help Drive the Next Era of AI
Processing
- VDX3-ETX, A Standard ETX3.0 Form Factor Module Between Tradition and Innovation, Will Be Supplied At Least Another 5+ years
- Sondrel Explains the Vital Coordinating Role of Systems Architects
- EMA Design Automation Expands Operations in Central Europe
- Infineon Introduces the AIROC™ CYW20829 Bluetooth® LE System on Chip
