IoT
Multimedia
Entering the Metaverse and How Shortages Impact Engineers on the Street
January 20, 2022
This week, the Insiders recap a COVID-era Consumer Electronics Show and debate one of CES’s hottest topics: the metaverse. Broadly speaking, the metaverse could be an in-between where physical reality and virtual reality collide, or it could be an entirely digital alternate universe.
AI & Machine Learning
- Google Presents Predicting Text Readability Through Reader Interactions
- CEVA Announces NeuPro-M Heterogeneous and Secure Processor Architecture
- Avalanche Computing Launches Low-Code AI Tool at CES 2022
- MultiTech and Megh Computing Collaborate to Provide Video Analytics Over Private LTE
Consumer
- Veea’s Smart Hub Adds Wi-Fi 6 Mesh Router Technology
- Guide Sensmart Releases Consumer Grade Autofocus Thermal Camera for Smartphones
- CY Vision Launches AR Technology for Windshields for Next-Generation Vehicles at CES 2022
- GAF Energy Announces Timberline Solar: Combines Solar and Traditional Roofing Installation and Materials
Debug & Test
- Solid Sands' SuperTest Extended by 3000 New Tests and Support for C++20
- Embracing a More Advanced Application Security Framework
- Rohde & Schwarz 5G mmWave Small Cell Test Solution Validated by Qualcomm Technologies, Inc.
- Traditional Development Processes Aren't Enough When Developing IoT Devices
Industrial
- TwinCAT 3 Directly Integrates OPC UA Pub/Sub
- Khronos and EMVA Issue Call for Participation for New Camera API Working Group
- Collaboration in the Workplace: How a New Generation of Cobots Is Improving the Nature of Manual Work
- Landing AI Welcomes Machine Vision Expert to Help Drive the Next Era of AI
Open Source
- Baumer, Infineon, Qualcomm Innovation Center, Percepio, and Silicon Labs Select Zephyr RTOS for their Next Generation of Products and Solutions
- Debian and Yocto Project: How to Get The Most Out of Your Linux Distribution
- Top 5 Microcontroller Development Boards of 2021
- Embedded Executive: Cliff Ortmeyer, Global Head of Technology Product Marketing, Newark
Processing
- Embedded Executive: Rajinder Cheema, SVP of Engineering, Socionext America
- VDX3-ETX, A Standard ETX3.0 Form Factor Module Between Tradition and Innovation, Will Be Supplied At Least Another 5+ years
- Sondrel Explains the Vital Coordinating Role of Systems Architects
- EMA Design Automation Expands Operations in Central Europe
Security
- QuarkLink IoT Security Management Platform Enhances Macronix's ArmorFlash Ecosystem
- BlackBerry Jarvis to Assist Developers with Executive Order 14028
- BlackBerry Launches New Managed Extended Detection and Response (XDR) Service
- Secure Thingz and Intrinsic ID Partner to Ensure Supply Chains of Trust for the Embedded Industry
