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AI & Machine Learning

The Road to embedded world: SAPPHIRE Technology to Exhibit AMD Embedded+ Edge AI Platforms

Chad Cox

February 26, 2026

embedded world Germany will have SAPPHIRE Technology (Booth 324) showcasing its portfolio of embedded and commercial computing platforms powered by AMD Embedded+ architecture. Available demonstrations will showcase how its heterogeneous computing is reshaping modern edge system designs.

Consumer

Protect Your Home from Thieves and Floods

Rich Nass

February 25, 2026

It’s always fun the weeks after CES, when some of the cooler the products you’ve seen on site in Las Vegas show up for real-life testing. This year, I took a look at two products, both wireless devices that are aimed at protecting the home.

Storage

The Road to embedded world: Weebit ReRAM Powers Live Edge AI Silicon Demos

Chad Cox

February 24, 2026

To demonstrate the benefits of its advanced Non-Volatile Memory (NVM) innovations, Weebit will be located at Hall 4, Booth 4-658 during embedded world Germany with live edge AI demos on silicon with its integrated ReRAM.

Security

EU CRA: Guidance for Non-IP Embedded Communication Systems

Prof. Axel Sikora , Julian Goeppert , Christian Keydel

February 24, 2026

In other words, reduce the likelihood of having your system hacked.

IoT

embedded world Germany: MSI IPC Unveils Industrial Edge AI Platforms for Smart Cities and Manufacturing

Chad Cox

February 23, 2026

Visitors can find MSI IPC at Hall 3-439 at embedded world Germany during March 10 to 12, 2026. MSI IPC will showcase its Edge AI computing innovations via live demonstrations designed for real world industrial and commercial applications.

Analog & Power

Dynamic CPU Power Management with cpufreq and schedutil

Daniel Thompson

February 23, 2026

We are looking at how cpufreq and its most sophisticated governor, schedutil, allow the kernel to take advantage of Dynamic Voltage/Frequency Scaling (DVFS).

AI & Machine Learning

Product of the Week: Innodisk’s APEX-E100 AI Box PC

Tiera Oliver

February 23, 2026

The increasing use of edge AI applications, such as GV, AMR, surveillance, smart city infrastructure, and visual inspection tasks, is coupled with the growing demand for solutions that are designed to keep these applications reliable, efficient, and versatile while operating in rugged environments.

Storage

The Road to embedded world: BIWIN ePoP5X Combines LPDDR5X and eMMC for Space-Constrained AI Devices

Chad Cox

February 22, 2026

Visitors to BIWIN’s booth (#1-140) at embedded world Germany will see the ePoP5X that combines LPDDR5X DRAM and eMMC storage into a single package, all facilitated by BIWIN's innovative multi-die stacking, ultra-thin die processing, and heterogeneous multi-chip integration technologies.

Processing

The Road to embedded world: EMASS ECS-DoT SoC Powers Real-Time Edge Inference

Chad Cox

February 20, 2026

During its exhibition at embedded world Germany, EMASS (Hall 4, Booth 4-483) will have application specific demonstrations with its ECS-DoT system-on-chip (SoC), a milliwatt-class, on-device AI platform designed for always-on intelligence, ultra-low latency, and reduced power consumption. Demos will highlight how ECS-DoT enables continuous sensing, inference, and decision-making directly on-device, without reliance on the cloud or regular battery replacement.

AI & Machine Learning

The Road to embedded world: Ceva to Bring Physical AI to Life

Chad Cox

February 19, 2026

Visitors to Booth 4-462 at embedded world Germany will get to view demonstrations from Ceva showcasing its AI Fabric, a unified foundation of connectivity, sensing, and inference IP that powers intelligent, autonomous edge systems. The integrated architecture facilitates scalable, power-efficient Physical AI across consumer, industrial, automotive, and infrastructure applications.

Software & OS

From IDEs to Integrated Suites: Embedded Development Tools Are Evolving Again

Embedded Computing Design Staff

February 19, 2026

For decades, embedded development has followed a fairly predictable path.

Processing

Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 FPGA Module at embedded world’ 26, Germany

Tiera Oliver

February 18, 2026

Sundance will present a compact, low-power system-on-module for FPGA/DSP-intensive applications at embedded world 2026 at the OpenSystems Media stand - Hall 1, Booth 1-500.

Industrial

The Road to embedded world: AntennaWare Launches First Low-Profile Alternative to Monopole Antennas

Chad Cox

February 18, 2026

According to AntennaWare, during embedded world Germany (Hall 3, Booth 3-423), the company will launch the first viable low-profile alternative to monopole antennas for Sub-GHz (868/915 MHz) applications thereby eliminating the trade-off between form factor and performance.

Healthcare

Wincomm’s New Medical All-in-One PCs Feature IP65 Front Panel, Built-In Power Supply, and “Clean Me” Mode

Chad Cox

February 24, 2026

Wincomm released the WMP-22T-PIS-L and WMP-24T-PIS-L, a 21.5” and 23.8” medical All-in-One PC designed for operating rooms (OR) and critical healthcare environments. The WMP-22T/24T-PIS-L series combines an advanced fanless design with a built-in power supply in an anti-bacteria aluminum housing weighing just 7.8 and 8.6 kg.