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SC19: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Five-Meter Samtec Cable Assembly - Press ReleaseNovember 26, 2019
eSilicon and Samtec co-developed system-level solutions that emulate next-generation data center architectures for typical 19-inch rack-mount applications
eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects - ProductOctober 07, 2019
The PHY supports 2.5D applications such as silicon interposers and silicon bridges for system-on-chip (SoC) to chiplets and SoC partitioning.
ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies - Press ReleaseSeptember 23, 2019
eSilicon and Samtec will demonstrate eSilicon's 7nm 58G DSP-based PAM4/NRZ SerDes capabilities for two challenging data center applications.
ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Five-Meter Samtec Cable Assemblies - Press ReleaseSeptember 20, 2019
eSilicon and Samtec will demonstrate eSilicon?s 7nm 58G DSP-based PAM4/NRZ SerDes capabilities for two challenging data center applications.
AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable - Press ReleaseSeptember 16, 2019
eSilicon and Samtec partner to deliver a rare booth-to-booth long-reach SerDes demonstration at AI Hardware Summit 2019.
New software maps high-level AI workloads to eSilicon's neuASIC modular AI ASIC IP platform.
eSilicon to Participate in Panel Discussion on Chiplet Design Experience at a Workshop presented by the Open Compute Project (OCP) - NewsJuly 01, 2019
Workshop will focus on new Open-Domain Specific Architectures (ODSA) sub-group