AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable
September 16, 2019
eSilicon and Samtec partner to deliver a rare booth-to-booth long-reach SerDes demonstration at AI Hardware Summit 2019.
eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will partner with Samtec, a leading global manufacturer of electronic interconnect solutions, to deliver a rare booth-to-booth long-reach SerDes demonstration at AI Hardware Summit 2019.
What & When
58G SerDes Demonstration: eSilicon & Samtec Booths at AI Hardware Summit
September 17-18, 2019
Using Samtec ExaMAX® Backplane Connector paddle cards and a five-meter ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of its 7nm 58G DSP-based PAM4/NRZ SerDes.
This demonstration highlights the SerDes performance, robustness and architectural flexibility supporting independent data rates and protocols on each individual lane (e.g., 50G PAM4 Ethernet, 24G NRZ CPRI and proprietary protocols up to 58Gb/s)
A broad set of monitoring and diagnostic tools are available through the eSilicon SerDes evaluation module kit and its graphical user interface to control, observe and analyze signal quality and performance metrics across the link in real time, including:
• Bit-error rate (BER) monitor
• Eye diagram monitor
• Equalization capabilities
• Error histogram monitor with post-FEC estimator