Winbond Electronics announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.
The risk to connected, wearable devices is real. Official bodies such as the US Food and Drug Administration (FDA) have issued a stream of warnings to device users and manufacturers about known risks.
If you have plans to design in a Qualcomm 9205 LTE modem, you may want to take notice of Winbond Electronics' latest flash memory device, the QspiNAND.
Rich Nass, EVP of Editorial, interviews Ilia Stolov with Winbond at the Trusted Computing Group, in the shared Embedded Pavillion, booth 3A-507. #ew18 #iot @embedded_world