Winbond and Ambiq Enable Intelligent IoT and Wearables on Ultra-low Power

By Tiera Oliver

Associate Editor

Embedded Computing Design

May 26, 2021

News

Winbond and Ambiq Enable Intelligent IoT and Wearables on Ultra-low Power

Winbond Electronics and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.

Per the companies, several customers are in design with Ambiq's Apollo4 SoC and Winbond 256Mbx8 HyperRAM Hybrid Sleep Mode (HSM), with volume production expected in 2022. HSM power consumption is about 50% if comparing to normal standby mode. HSM can assist IoT endpoints and wearable to extend more battery life.

The Apollo4 complete hardware and software solution is purpose-built to allow battery-powered endpoint devices to achieve a high level of intelligence without sacrificing battery life. According to the companies, adding HyperRAM can further enhance its low power advantage and allow for ideal delivery of high-resolution graphics to improve the performance.

HyperRAM key features:

  • 256Mb HyperRAM operation frequency: 200MHz/250MHz
  • 256Mb 30 ball WLCSP: 13 signal pads for x8 and 22 signal pads for x16
  • Available in a variety of form factors of AIoT end product, including 24BGA, WLCSP, and KGD
  • Sizes available from 32Mb to 256Mb

For more information, visit: https://ambiq.com/ or https://www.winbond.com

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Ambiq

6500 River Place Blvd.
Austin, TX 78730

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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