Winbond Partners with Nuvoton, Qinglianyun to Release Fully Integrated Reference Design for OTA Firmware Updating
March 24, 2021
Winbond, in partnership with Nuvoton and Qinglianyun, released a fully integrated reference design for secure OTA firmware updating of IoT devices.
Per a company press release, the reference design is based on the Nuvoton M2351SF IoT Security MCU, a multi-chip module consisting of the M2351 IoT Security microcontroller and Winbond’s W77Q TrustME® secure Flash memory IC. The M2351 microcontroller is based on the Arm Cortex®-M23 secure processor core with TrustZone technology.
In order to provide a trusted execution environment (TEE) for secure OTA firmware updating, the device operates on Qinglianyun’s TinyTEE secure software stack in TrustZone-protected hardware.
Further, the software connects to Qinglianyun’s secure cloud service, providing a suite of IoT device management capabilities including device authentication, secure storage, encryption engines, and a random number generator, all of which comply with the Global Platform TEE standard interface.
Aside from secure storage, the solution also provides the following security features:
Secure boot and root-of-trust
Authenticated and encrypted data transfer between the Flash device and the host
Secure Execute-in-Place (XiP) of boot and application code
System resilience, supporting the key security functions of protection, detection and recovery
For more information, visit www.winbond.com.