Embedded Computing Design

Siemens Digital Industries Software and United Microelectronics (UMC) are collaborating to develop and execute a new multi-chip 3D integrated circuit (IC) planning, assembly validation, and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.

Geneva –- STMicroelectronics’ STM32 microcontrollers can now be used for the development of embedded software projects through the company’s STM32 Hotspot organization on GitHub, a community where developers can utilize non-productized code created by ST engineers.

Monheim am Rhein, Germany – October 10th, 2022 – SEGGER announced native J-Link debug probe support for select use cases with the Cadence Tensilica Processor IP. The Cadence Tensilica cores supported in the first implementation phase are the Tensilica Xtensa LX7 CPU, a number of Tensilica HiFi DSPs (HiFi 4, HiFi 3z, HiFi 3, and HiFi 1), and also the Tensilica Fusion F1 DSP.

Stockholm and Irvine, Calif., – Imagimob and Syntiant Corp are collaborating to integrate Imagimob’s tinyML platform with Syntiant’s ultra-low-power NDP120 Neural Decision Processor, enabling the development of production-ready deep learning tinyML applications and ML models using the NDP120 for sound event detection, keyword spotting, fall detection, anomaly detection, gesture detection and more.

Oberursel / Frankfurt, Germany, – MEMPHIS Electronic has plans to release a family of DDR5 memory modules based on Samsung’s DDR5 chipsets in commercial and industrial temperature ranges, and configured with 16 and 32 Gigabyte capacities and 5600 MHz clock frequency.

San Jose, California and Guangzhou, China -- GOWIN Semiconductor Corporation released its new generation Arora V high performance FPGA family featuring advanced 22nm SRAM technology.

Bensheim, Germany –– TE Connectivity (TE) developed the PicoMQS miniaturized automotive connector system for compact signal interfaces deployed in high temperature and high vibration automotive applications.

Seattle, WA and Stuttgart – Lumotive and Gpixel announced the availability of the M30 Reference Design Platform consisting of Lumotive’s LM10 LCM™ beam steering chip and Gpixel’s GTOF0503 ToF sensor for next-gen 3D lidar sensors for mobility and industrial applications, such as autonomous navigation robots for logistics use cases.

TOKYO-- Renesas Electronics Corporation announced that its 8A34001 System Synchronizer for IEEE 1588 has been integrated in the AMD Zynq® UltraScale+™ RFSoC DFE ZCU670 Evaluation Kit and reference design for 5G New Radio (5G NR).

SANTA CLARA -- AMD introduced the Ryzen™ Embedded V3000 Series processors, adding the performance of the “Zen 3” core to the V-Series portfolio for increased processing performance in storage and networking applications. When compared to the previous AMD Ryzen Embedded V1000 series, the V3000 series boasts greater CPU performance, DRAM memory transfer rate, CPU core count, and I/O connectivity.

Mobile World Congress, LAS VEGAS – Quectel Wireless Solutions released its new SC680A smart module featuring the Qualcomm QCM4290 platform and a customized 64-bit ARM v8.0 compliant octa-core Kryo 260 application processor enabling speed and on-device performance for mid-tier IoT devices such as POS, industrial handhelds for logistics and warehousing, in-vehicle infotainment and dashcam solutions, micro-mobility applications, and small electric cars.

SAN JOSE and MILPITAS, Calif. — The Autonomous Vehicle Computing Consortium (AVCC) and SEMI announced an alliance to drive autonomous vehicle innovation. The terms of the agreement state that both leadership and members of the two organizations will jointly promote the development of technology standards, and offer recommendations for driving mass market adoption of autonomous vehicles.

SANTA CLARA, Calif. -- SiTime Corporation introduced a new automotive oscillator family, based on SiTime’s advanced MEMS technology. The new SiT9396/7 precision timing solutions are designed to ensure the reliability and flexibility of level 4 and 5 ADAS, domain/zone controllers, radar, and LiDAR subsystems.

MOUNTAIN VIEW, Calif. – Flex Logix Technologies announced the InferX Hawk, a hardware and software-ready mini-ITX x86 system enabling the customization, build, and deployment of edge and embedded AI systems.

NXP Semiconductors and Elektrobit are collaborating to co-develop a software platform to support NXP’s high-voltage battery management system (HVBMS) reference design.

BEIJING, China and SAN JOSE, Calif., USA -- The second-generation of the advanced automotive touch-sensing technology, a formula material sensor and advanced algorithm from Taifang Technology, the Taifang Automobile Intelligent Perception System 2.0 (TAIPS), was announced with increased system incident sensitivity from the previous TAIPS 1.0 version.

CHANDLER, Ariz., Microchip Technology announced a new family of Terabit-scale Ethernet PHYs (physical layer), the META-DX2+, designed to provide OEMs the ability to double router and switch system capacities with 112G PAM4 connectivity for 800G ports, and support for encryption and Class C/D precision timing.

SANTA CLARA, CA – Today, NVIDIA released a new line of Jetson Orin Nano system-on-modules (SoMs), an expansion of the previous Jetson Nano series that’s 80x faster with the ability to deliver up to 40 trillion operations per second (TOPS) of AI performance in a small, compact package.

ERLANGEN, GERMANY – Elektrobit and Argus Cyber Security launched the EB zoneo SwitchCore Shield, a pre-integrated embedded intrusion detection and prevention (IDPS) solution designed for network management systems in next-generation vehicles.

AUSTIN, TEXAS. Release 7.0 of the StarlingX open-source edge computing and IoT cloud platform is now available to help Industrial IoT enterprises deploy ultra-low latency edge clouds.