In this episode of Embedded Insiders, we’re joined by embedded systems veteran Steve Yates, founder of ADI Engineering and now Founder & CEO of StellarIoT. Steve dives into his latest venture, a platform designed to support rugged, AI-powered digital transformation in remote industries—combining open software, rugged hardware, satellite, private 5G connectivity, and zero-touch AIoT operation.

Every once in a while, we hit a home run when it comes to bringing guests onto the DevTalk podcast, and today we did just that. 

We managed to wrangle in Hidetoshi Shibata, who has been in his current CEO role at Renesas for about six years. Toshi was very forthcoming with us, as we went through his fairly colorful past, and more importantly, the decisions he has had to make as the CEO of one of the most powerful companies in our space. 

To bring focus onto a pair of major announcmeents for Renesas, the company hosted a virtual press conference to announce its new single- and dual-core MCUs for Edge AI, and new GaN FETs for high-density power conversion in AI data centers, industrial and charging systems.

Wirral, United Kingdom. LDRA publicized it joined both the Renesas Ready Partner Network and the R-Car Consortium. The relationship extends LDRA's support to seamlessly incorporate system development tools utilizing Renesas R-Car system on a chip (SoCs), microprocessors (MPUs), and microcontrollers (MCUs) that are required to be in full compliance with industry-wide functional safety and cybersecurity standards.

Renesas Electronics Corporation and Altium recently announced the 2026 expected release of the Renesas 365, a solution streamlining electronics system design from silicon to lifecycle management. The announcement follows news of Renesas’ acquisition of Altium, showing how prominent the collaboration will be. The environment is built on the Altium 365 platform.

MUNICH, Germany and TOKYO, Japan ― Renesas Electronics Corporation launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single chip.

San Jose, California. Tessolve and Renesas collaborated to develop Tessolve’s SMARC SOM compatible with SMARC standard 2.1 and based on the RZ/V2H MPU leveraging four Arm Cortex-A55 CPU cores alongside two Cortex-R8 cores, one Cortex-M33, and an AI Accelerator (DRP-AI3) capable of eight TOPS/dense and 80 TOPS/sparse.