SECO Releases New COM EXP T7 Development Kit

By Perry Cohen

Associate Editor

Embedded Computing Design

March 12, 2020

News

SECO Releases New COM EXP T7 Development Kit

Seco has released the COM Express T7 DEV KIT, a Cross Platform Development Kit compatible with both x86 and Arm COM Express Type 7 modules.

SECO has released the COM Express T7 DEV KIT, a Cross Platform Development Kit compatible with both x86 and Arm COM Express Type 7 modules.

It has 12 VDC power in connector for COM Express module’s working Cabled Coin-cell connector for RTC. Additionally, it can operate in a temperature range of 0°C - +60°C.

The kit also features four USB 3.1 Host ports on Dual Type-A sockets, and a wide range of networking options that include the following:

  • One GbEthernet RJ-45 connector
  • Four 10Gbase-KR interfaces on OCP Type-C connector
  • Four MDIO I2C interfaces on internal pin header
  • Four SDP interfaces on SMA RF connectors

Within the development kit, consumers will receive a CCOMe-C79 carrier board, a header adapter cable, two serial adapter cables, one SATA cable, and a standard OCP module (10GBE).

For more information, visit www.seco.com.

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30 W. Gude Dr. suite 550
Rockville, MD 20850

Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation, podcast production, and social media efforts. Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university.

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