SECO Releases New COM EXP T7 Development Kit
March 12, 2020
Seco has released the COM Express T7 DEV KIT, a Cross Platform Development Kit compatible with both x86 and Arm COM Express Type 7 modules.
SECO has released the COM Express T7 DEV KIT, a Cross Platform Development Kit compatible with both x86 and Arm COM Express Type 7 modules.
It has 12 VDC power in connector for COM Express module’s working Cabled Coin-cell connector for RTC. Additionally, it can operate in a temperature range of 0°C - +60°C.
The kit also features four USB 3.1 Host ports on Dual Type-A sockets, and a wide range of networking options that include the following:
- One GbEthernet RJ-45 connector
- Four 10Gbase-KR interfaces on OCP Type-C connector
- Four MDIO I2C interfaces on internal pin header
- Four SDP interfaces on SMA RF connectors
Within the development kit, consumers will receive a CCOMe-C79 carrier board, a header adapter cable, two serial adapter cables, one SATA cable, and a standard OCP module (10GBE).
For more information, visit www.seco.com.