ADLINK Technology, Inc.
San Jose, CA 95138 [email protected]
ADLINK Launches the DLAP x86 Series, a Deep Learning Acceleration Platform for Smarter AI Inferencing at the Edge - NewsFebruary 02, 2021
A compact, high performing GPU-enabled deep learning acceleration platform for deploying AI at the edge across industrial applications
New Computer-On-Module (COM) High-Performance Computing (HPC) specification targets the increasing server-level requirements of high-end computing applications on the edge.
Now that neural nets are the algorithm of choice, AI development frameworks are maturing & first-gen AI processors are hitting the market, we face a stark realization: We have to deploy these things!
The Titan-AL is able to withstand high pressure, hot water cleaning, as it sits within a 316L (V4A) stainless steel housing. It is also resistant to oxidization and other chemical reactions.
ADLINK released the cExpress-TL, its newest generation COM Express Type 6 module. The module is based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor.
ADLINK's AIOMs (AI-on-Modules) will allow developers of AI-enabled embedded systems to design and deploy future-proof cost-effective products quickly and efficiently.