THE PICMG COM-HPC SUBCOMMITTEE
New Computer-On-Module (COM) High-Performance Computing (HPC) specification targets the increasing server-level requirements of high-end computing applications on the edge.
For the first time in many years, high-end embedded processors are available on two Computer-on-Module form factor options, COM-HPC® Client and COM Express® Type 6.
The PCI Industrial Computer Manufacturers Group (PICMG) announced it is completing the development of a new COM-HPC computer-on-module specification for the industrial edge computing market.
What the embedded computing industry is preparing for is the next generation of standards for modular system designs. COM-HPC will be THE focus of nearly all embedded computing vendors.
It?s a wonderful gift that the PICMG was brought to us with the approval of the pinout for the new high-performance COM?HPC Computer-on-Module specification.