For the first time in many years, high-end embedded processors are available on two Computer-on-Module form factor options, COM-HPC® Client and COM Express® Type 6.
SMARC 2.0 modules stand out thanks to their large number of graphics, camera, sound, network and optional wireless interfaces.
What the embedded computing industry is preparing for is the next generation of standards for modular system designs. COM-HPC will be THE focus of nearly all embedded computing vendors.
It?s a wonderful gift that the PICMG was brought to us with the approval of the pinout for the new high-performance COM?HPC Computer-on-Module specification.
Scheduled for the first half of 2020, there is still some time to go before the final PICMG ratification of the COM-HPC specification.
Medical devices with ultrasound-guided navigation ease needle placement for healthcare professionals - OtherMay 05, 2017
"Stop – you have reached your destination." With increasing traffic in healthcare centers, clinics face many challenges. Ultrasound-guided dev...