Sondrel

Articles related to Sondrel
AI & Machine Learning

Sondrel Completes a Multi-Billion Transistor Chip Design at 5nm - Press Release

January 23, 2024

Sondrel (LON: SND), a leading provider of ultra-complex chips for leading global technology brands, has announced that it has completed its most complex chip design to date. Designed on a 5nm process node, this ultra-complex design has more than 50 billion transistors.

 

Processing

Sondrel and Siemens Sign Signatures Continuing Partnership - News

April 04, 2023

Reading, United Kingdom. Sondrel will be continuing to leverage Siemens EDA software with a new three-year contract. The partnership will keep Sondrel leading the global semiconductor market with customer specific ultra-complex ASIC chip solutions concerning EDA software applications.

Processing

Sondrel Releases Off-the-Shelf Supply Chains for its Architecting the Future IP Platforms - News

September 15, 2022

Reading, UK. Sondrel released its Architecting the Future family covering the SFA 100 to the SFA 350A.

Processing

Sondrel Explains the Vital Coordinating Role of Systems Architects - Press Release

January 13, 2022

Leading edge digital ASIC design becomes more complex every year needing teams of dozens of people working on all the different aspects of it. According to Sondrel, who specialises in these advanced chip designs, there is a growing need for Systems Architects who coordinate every aspect of a design project, hence the company is actively recruiting for specialists with the skill sets that can do this.

IoT

Sondrel's SFA 100 IP platform for the Edge - News

July 15, 2021

Sondrel's new SFA 100 IP reference platform makes creating high-performance battery powered IoT devices fast and easy.

Processing

Sondrel Launches the Fourth IP Platform, SFA 350A, for ADAS ASICs - News

June 03, 2021

Sondrel launched its new, quad-channel, IP reference platform that has been architected with ISO26262 applications and the integration of customer IP in mind.

Processing

Sondrel Reference IP Enables HPC SoCs While Reducing Cost and Design Time by 30 Percent - News

May 18, 2021

Sondrel has added the SFA 300 reference design to its semi-custom SoC IP portfolio. Consisting of four-CPU clusters featuring 4 TOPS per channel of AI processing and 400 GOPS per channel of DSP performance, clusters can be daisy chained via the PCIe interface to create HPC solutions. The IP reuse solution enables the creation of differentiated AI, 8K video, blockchain, data analytics, and other high-performance data processing solutions by integrating customer-specific IP such that design time and cost can be reduced by up to 30 percent.