Embedded Computing Design

Cognizant announced today a new collaboration with Siemens Digital Industries Software to integrate Siemens' PAVE360™ into its software-defined vehicle (SDV) solution accelerator. The Cognizant solution accelerator aims to address resource and complexity challenges by enabling continuous and simulated verification and validation across vehicle development.

San Diego, CA, January 7, 2025 -- congatec expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COMs) with the conga-HPC/cBLS, developed especially for power-hungry edge and infrastructure applications.

Cupertino, CA – PIMIC announced its official corporate launch, unveiling its mission to deliver cutting-edge AI inferencing silicon designed to power the next generation of intelligent, voice-activated edge devices (VAD) including toys, home and business audio systems, wearables, and robots.  

TDK Corporation announced push-in wire terminations for models in the high-reliability, TDK-Lambda HWS-A family of AC-DC power supplies.

Taichung, Taiwan – Winbond Electronics Corporation announced the enhanced LPDDR4/4X DRAM products, specifically designed for the latest generation of automotive applications. These solutions are designed to offer significant advancements in power efficiency, performance, and carbon reduction.

MUNICH, Germany and TOKYO, Japan ― Renesas Electronics Corporation launched the new generation of automotive fusion system-on-chips (SoCs), serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle infotainment (IVI), and gateway applications on a single chip.

Beaverton, OR – Tektronix announced a new lineup of power devices designed to accelerate industries demanding greater power capacity and efficiency. The new TICP Series IsoVu™ isolated current probes utilize RF isolation to deliver precision and safety when measuring fast-changing current across low- and high-voltage systems.

ESPOO, Finland, and LONDON, UK --  Xiphera, a provider of highly optimized, hardware-based cryptographic security, announced its partnership with Crypto Quantique, a provider of quantum-driven IoT device security.

SAN JOSE, Calif.--Rambus Inc. unveiled industry-first, complete memory interface chipsets for Gen5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs).

SEGGER has announced support for Microsoft exFAT with emFile, SEGGER’s fail-safe file system for embedded systems. emFile is optimized for high speed, versatility, and minimum memory consumption in RAM and ROM.

Microchip Technology announced its new family of LAN969x Multi-Gigabit Ethernet Switches and VelocityDRIVE™ Software Platform (SP), a turnkey Ethernet switch software solution and Configuration Tool (CT) based on standardized YANG models.

The embedded systems landscape is ever-evolving and various industry professionals eagerly await embedded world North America 2024.

Greater Los Angeles, CALIFORNIA, - September 3rd, 2024 -- Premio Inc., announced the release of its newest All In One Industrial Touch Panel PC, supported by Intel 12th Generation Alder Lake-N processors, and the release of its newest Open Frame Industrial Touch Panel PC, supported by Intel 12th Generation Alder Lake-N processors.

TDK Corporation announced additional output voltage models to the 250W-rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2” x 4” footprint. The full range now covers 12V, 15V, 18V, 24V, 28V, 36V, and 48V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations.

Taichung, Taiwan – Winbond Electronics Corporation unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash solution designed to meet the demands of wearable and battery-operated IoT devices with low standby power, small-form-factor package, and continuous read for fast boot and instant-on support.

SCOTTSDALE, Ariz. – onsemi introduced its latest silicon carbide technology platform, EliteSiC M3e MOSFETs. The company also disclosed plans to release multiple additional generations through 2030.

DALLAS -- Texas Instruments (TI) introduced six new power modules designed to improve power density, enhance efficiency, and reduce EMI. These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% to support industrial, enterprise, and communications application designers. 

MILPITAS, Calif, –  Orca Semiconductor has emerged to deliver the personalization and high-level support, demanded by customers. Orca also announced it is sampling its first product, the OS1000, the advanced PMIC (power management integrated circuit) developed for health wearables, hearables, and other connected devices.

Fremont, Calif., – Penguin Solutions™, an SGH™ brand, announced the expansion of its OriginAI® solution to include validated, pre-defined AI architectures incorporating NVIDIA technology.

Nijmegen --  Nexperia announced that its 650 V, 10 A silicon carbide (SiC) Schottky diode is now automotive qualified (PSC1065H-Q​) and available in real-two-pin (R2P) DPAK (TO-252-2) packaging, making it suitable for various applications in electric vehicles and other automobiles.