Embedded Computing Design

Kraków, Poland. AVSystem is attending embedded world 2024 located in hall 5 at stand 456 from April 9th to 11th. AVSystem’s will showcase its IoT solutions as well as a joint venture with Semtech.

Wixom, Michigan. Acromag released its XMC-ZU5EV module combining an AMD (Xilinx) Zynq UltraScale+ with a quad-core ARM Cortex A53, a dual-core ARM Cortex R5, and FPGA logic in a single chip. Also included are dedicated processing blocks for graphics and Video.

Chicago, Illinois. Newark will now carry NI’s LabVIEW+ Suite that includes LabVIEW plus, TestStand, DIAdem, and FlexLogger. The software bundle contains tools for test, analysis, and measurement. Newark Vice President, Global Product & Supplier Management, Lee Turner, said, “The LabVIEW+ Suite can help development engineers make faster decisions, prototype more efficiently, and validate their work with greater ease. With its ability to deliver a wealth of usable data, this suite is a valuable asset for any engineer looking to streamline their workflow."

Chandler, Arizona. Microchip Technology released its PolarFire SoC Discovery Kit leveraging the PolarFire MPFS095T SoC FPGA highlighting a quad-core 64-bit CPU based on the RISC-V Instruction Set Architecture (ISA). The kit supports rapid examination of application concepts, firmware development, and code debugging.

BlackBerry Limited released its fifth generation QNX Software Development Platform (SDP) 8.0 that delivers a scalable high-performance real-time operating system when combined with the next generation QNX OS 8.0. The platform has been designed on a decade of safe and field proven technology maintaining its POSIX API for a prompt beneficial environment for both QNX and Linux developers.

ByteSnap Design released its Automated Electronic Product Design Service offering hands-free design solutions aimed at accelerating product time to market. ByteSnap defines specification requirements, creates a product's path, establishes project timelines, and brings together development and testing activities, all while adjusting to ever changing requirements.

Anders introduced its DRAGONEYE development kit based on the STM32F4 series leveraging an ARM Cortex M4 for design, testing, and assessing performance within GUI applications, software control, I/O, and more. The solution simplifies design and brings together all the resources required for development and debugging in a reduced lead time.

Malvern, Pennsylvania. Vishay Intertechnology, Inc. released its high speed silicon PIN photodiode with enhanced sensitivity for visible light in a compact 2.0 mm by 1.8 mm by 0.6 mm top-view surface-mounted casing with transparent epoxy for heightened sensitivity. The VEMD2704 bsupports rapid switching times of 70 ns and minimal capacitance of 17.6 pF, ensuring accurate signal detection in wearable devices.

MVTec Software GmbH will showcase its machine vision solutions during embedded world 2024 (Booth 454, Hall 2) where it will bring its motto, "Embedded Vision = YOUR Hardware + OUR Software." Highlighted will be software that aids in smart cameras and sensors.

Newark will now distribute Taoglas’ antennas and IoT devices. Through the partnership, Newark is offering customers an extended range of RF and wireless products, with on-time delivery and inventory, ensuring a seamless transition from the prototype to production.

San Jose, California. MontaVista Software, LLC introduced its Zero Trust and Secure-by-Design features for the MVShield and MVSecure line of products to secure the entire Software Supply Chain for Enterprise Linux/MVShield applications such as radio and core networking, Intelligent Edge, network and application security appliances, and more.

Aetina and NVIDIA are collaborating to deliver the latest vision AI platforms integrating Aetina’s products powered by NVIDIA Jetson AGX Orin and Orin NX modules with NVIDIA Metropolis Microservices for Jetson. NVIDIA Metropolis Microservices for Jetson enables designers to innovate their app stack, streamline development and deployment, and future-proof apps delivering the latest generative AI.

Wincomm released its WMP-19S/22S/24S portfolio of EN 60601-1 & 60601-1-2 compliant medical devices specifically for AI assisted diagnosis and hospital management. Graphics are provided by Nvidia’s MXM A4500/A2000/A1000 while the solution also delivers optional UPS battery, one PCIex4 expansion slot, video in (RGB color adjustment), and a GPI integrated capture card allowing quick image creation and beamforming.

PLS Development Tools will be attending embedded world 2024 where they will be located in Hall 4, Booth4-310. Its exhibitions will include platforms for simple and efficient debugging and run-time analysis of embedded software. A main focus at the booth will be discussions based around the safety and security in the automotive and industrial markets.

Conclusive Engineering released the RCHD-PF Orchid, its latest system on module (SoM) integrating a Microchip PolarFire SoC FPGA with a 667 MHz 5-core RISC-V processor ranging from 23K to 254K logic elements. The solution is ideal for computationally intense applications. Operating temperature is between -40 °C to 85 °C powered by a single 3.3V 12A in a 65x45 mm package.

A decade later, NEXCOM returns to the Embedded World 2024, stationed at Hall 5, Stand 5-253! As a distinguished global leader in edge computing and industrial IoT solutions, NEXCOM is set to showcase its cutting-edge software-defined embedded computing solutions through six vertical market pavilions: 5G Edge, Manufacturing X, Transportation AI, Smart Edge · Smart City, Software-Defined Edge Computing, and OT Cybersecurity.

Los Angeles, California. Premio Inc introduced its newest x86 single board computer powered by the 12th Generation of Intel’s Alder Lake-N processors. Utilizing the same Gracemont CPU architecture present in the Efficiency cores of 12th/13th Generation Intel Core CPUs, the Alder Lake-N platform exhibits improved performance over earlier Intel processors, achieving an increase of up to 28% and a 42% with the Core i3 N-Series processor.

Deggendorf, Germany. congatec is including the firmware integrated Hypervisor in all new x86 COMs aimed at streamlining real-time virtualization for system consolidation. The solution makes it easier to save money and reduce individual systems while also reducing size, weight, and power (SWaP).

SYSGO's RTOS PikeOS and hypervisor reached the highest-level of space safety standard ECSS-E-ST-40C (Category A) for the first time. PikeOS' hypervisor functionality combines heterogenous systems allowing for the design of mixed-critical platforms saving costs, space, energy, and weight. According to the company, flight control, gateway, and monitoring can safely and securely run simultaneously in time and space.

Hod Hasharon, Israel. Valens Semiconductor launched the VA700R Series delivering 4Gbps of bandwidth and link distances up to 40 meters/130 feet ideal for longer vehicles. "Valens Semiconductor's connectivity solutions are high-performance – and that doesn't just mean the highest bandwidth or the lower error rate – it also means the longest link distance," said Gideon Kedem, SVP and Head of Automotive Business at Valens Semiconductor.