Weebit Completes Design and Tape-Out of Embedded ReRAM Module
July 14, 2021
Weebit Nano Limited announced that it has completed the design and verification stages of its embedded ReRAM module, and taped-out (released to manufacturing) a test-chip that integrates this module.
The integrated test-chip will be used as the final platform for testing and qualification, ahead of customer production.
The test chip comprises a full sub-system in which the module is embedded. It also includes a RISC-V microcontroller (MCU), system interfaces, Static Random-Access Memory (SRAM), and peripherals. Potential customers can use it as a development and prototyping platform for new products such as low-energy Internet of Things (IoT) devices.
Weebit’s new memory module is customisable and provides a foundation for the Company’s future ReRAM compiler, which will enable customers to reconfigure the design according to their specific requirements without going through manual design and fab qualification processes. The module will also be the basis for other ReRAM modules that Weebit will develop, tape-out, and qualify at production fabs based on customer requests starting later this year.
The ReRAM module was designed in the ST 130nm process after interaction with potential customers showed it is the sweet spot for their analog, power, sensor, and IoT designs. It includes a 128Kb ReRAM array, control logic, decoders, IOs (Input/Output communication elements), and error correcting code (ECC).
Weebit expects to have its first silicon of the embedded ReRAM module towards the end of this year. The company plans to demonstrate the module and report functional testing results in the first quarter of 2022. Qualification of the module is expected by mid-2022.
For more information, visit: www.weebit-nano.com/