TechInsights Announces In-depth Analysis of 9XL 3D NAND Semiconductor Solutions
June 17, 2019
TechInsights maintains the world?s largest database of semiconductor and advanced technology analysis.
OTTAWA, Canada, June 4, 2019 — TechInsights, global leaders in the reverse engineering of semiconductors in advanced technology products, announced it has completed several in-depth reports on solutions for the 9 XL 3D NAND market. NAND flash memory is the second largest IC product category today, with over $60B in revenue in 2018, representing an increase of 18% over 2017. Growth has been fueled by a higher average selling price, growing use of solid-state drives in data center server storage, and larger memory capacity in smartphones.
“As planar fades-out and 3D NAND is increasingly commercialized, patent holders will benefit from this technology-specific EoU when preparing for patent portfolio activities.” said Mike Mclean, TechInsights’ SVP of Technology. “Technology professionals will equally benefit from an understanding of these disrup-tive events; how each company approached their solutions, what these changes mean to this technology space, and which solutions appear in what products.” TechInsights has examined numerous solutions including the Samsung 92L 3D V-NAND, Toshiba 96L 3D BiCS, and Intel/Micron 96L 3D FG/PUC NAND Flash devices, with additional analysis ongoing, including: · Circuit Extraction and Analysis · Structural / Materials Analysis · Packaging Analysis · Transistor Characterization · Waveform Analysis
TechInsights is also looking to see solutions from YMTC and SK hynix
o YMTC 32L 3D NAND
o SK hynix 4D (PUC) 96L NAND To learn more about TechInsights analysis of 9X Layer 3D NAND products, download the brief here.
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