Embedded world 2021 Conference Session: Impact of the 3rd Edition of IEC 61508-1/-2 on Your Development

February 10, 2021

Press Release

Embedded world 2021 Conference Session: Impact of the 3rd Edition of IEC 61508-1/-2 on Your Development
(Image courtesy of embedded world)

Nuremberg, Germany – On Monday, March 1st, 11:00 – 11:30AM CET, exida.com’s Stephan Aschenbrenner will be presenting “Impact of the 3rd Edition of IEC 61508-1/-2 on Your Development” at the first all-digital embedded world exhibition and conference.

The second maintenance process is underway for IEC 61508. Being that it is a basic safety publication, altercations to the standard will impact application specific standards and the development of new products. Aschenbrenner’s presentation will provide an overview of the modifications, in addition to highlighting important parts and their possible impact on the developments of today and in the future.

Furthermore, a third edition of IEC 61508 is on its way, which will update the requirements for the development and selection of complex semiconductors. This improves the topic of common cause failures.

What does this mean for your development? Click HERE to register.

For more information, visit exida.com.

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