Lattice Semiconductor Releases New CrossLink Reference Design
July 17, 2019
New SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design helps machine vision and robotics applications leverage advanced application processors.
Lattice Semiconductor Corporation launched its SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design. It offers a flexible, easy-to-implement solution for industrial device customers for connecting advanced application processors (APs) with image sensors being used in modern machine vision applications for industrial environments.
The SubLVDS to MIPI CSI-2 Image Sensor Bridge includes:
· 4, 6, 8, or 10 lane SubLVDS input to 1, 2, or 4 lane MIPI CSI-2 output
· Up to 1.2 Gbps bandwidth per input lane
· Up to 1.5 Gbps bandwidth per output lane
· Dynamic parameter setting via I2C
· Optional support for image cropping
“In industrial environments, customers are interested in upgrading legacy machine vision applications to take advantage of the processing capabilities and feature sets of new APs,” said Lattice Semiconductor’s Product Marketing Manager, Peiju Chiang. “Rather than devote precious time and engineering resources on an extensive device redesign, the Lattice CrossLink SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design provides a simple workaround that addresses legacy interface compatibility issues to get redesigned products to market quickly and cost effectively.”
Learn more at www.latticesemi.com.