UP Xtreme from AAEON

By Tiera Oliver

Associate Editor

Embedded Computing Design

December 23, 2019

News

UP Xtreme from AAEON

AAEON announces the latest product from the UP brand, the UP Xtreme board and UP Xtreme Edge system, built for AI and Industrial IoT applications.

AAEON, designer and manufacturer of factory AI and Edge Computing solutions, announces the latest product in the UP line of products, the UP Xtreme board and UP Xtreme Edge embedded system, also called UPX Edge. With the power of the 8th Generation Intel Core processors, the UP Xtreme is built to power industrial automation, robotics, AI, and IoT applications.

The UP Xtreme represents the third generation of UP Board products, powered by 8th Generation Intel Core and Celeron processors (formerly Whiskey Lake) with up to 16GB of onboard RAM and 64GB of eMMC memory. The UP Xtreme is capable of 4K video output, and features a built-in audio jack as standard.

The UP Xtreme brings industrial grade features to the UP line of products, such as 12~60V wide voltage power input, two RS232/422/485 10-pin headers, and time sensitive networking (TSN) to facilitate communication in a connected factory. The UP Xtreme is also built to perform in temperatures ranging from 0°C up to 60°C.

The UP Xtreme offers both a 40-pin and 100-pin connector, as well as m.2 2230 and 2280 slots, and mPCIe slots. The UP Xtreme can be expanded with wireless modules for Wi-Fi, Bluetooth, 4G and LTE. The UP Xtreme is compatible with other UP Board modules, including the AI Core X, AI Core XM 2280, and Vision Plus X, all featuring the Intel Movidius Myriad X. With each module installed, the UP Xtreme supports up to six Intel Movidius Myriad X modules.

AAEON also offers the UPX Edge system. Utilizing an innovative fanless design and thermal solution, the UPX Edge can operate in conditions, from -20°C to 70°C (tested with AI Core XM, 2x Intel Movidius Myriad X).

For more information, please visit: www.aaeon.com.

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AAEON Technology Inc.

5F, No. 135, Lane 235, Pao Chiao Rd.
Hsin-Tien Dist, New Taipei City 231

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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