TQ Introduces New Intel Atom x6000E Based Computer-on-Module Product Family

By Tiera Oliver

Associate Editor

Embedded Computing Design

October 05, 2020

News

TQ Introduces New Intel Atom x6000E Based Computer-on-Module Product Family

For the new standard modules TQMxE40M, TQMxE40S, and TQMxE40C1/C2, TQ relies on the Intel Atom x6000E processor family of the 6th generation.

German technology company, TQ, announced the TQMxE40 module family based on the processors of the latest Intel Atom x6000E as well as Intel Pentium and Celeron N and J series (codenamed "Elkhart Lake"). The internationally established form factors COM Express Mini, COM Express Compact, and SMARC are supported. The embedded modules are suitable for industrial automation, medical technology, measurement technology, robotics as well as transport and logistics applications.

For the new standard modules TQMxE40M, TQMxE40S, and TQMxE40C1/C2, TQ relies on the Intel Atom x6000E processor family of the 6th generation, which will be available with 12 different CPU derivatives for different performance classes and operating conditions. The processors, available as dual- and quad-core versions, are ideal compared to previous generations by an increase in computing and graphics performance. An economical headless variant without graphics will also be available. The processors are specified with a thermal power dissipation between 4.5 W and 12 W and, depending on the variant, with an extended temperature range (-40°C to +85°C ambient). For the first time in this processor class, per the company, up to 64 GB RAM are supported.

The memory interface of the COM Express Mini module, TQMxE40M, is equipped with the ideal LPDDR4/4x technology. The memory capacity can be selected in the range from 4 to 16 GByte. Up to four 3rd generation PCI Express lanes (8 GT/s) are available for the connection of up to 4 peripheral devices and can be configured in the BIOS.

For the first time in the Atom range, per the company, the new USB 3.2 Generation 2 standard is supported, which allows transfer rates of up to 10 Gbit/s. Two ports are available for this purpose. In addition, the module can be equipped with up to 256 GB eMMC flash. The COM Express Mini module, TQMx40M, with its compact dimensions of 84 mm x 55 mm and Type 10 pinout is fully PICMG COM0 R3.0 compliant. The TQ mainboard, MB-COME10-2, can be used for evaluation. Together with an 11 mm heatspreader and a heatsink, this results in an ideal evaluation platform.

The SMARC 2.1 module TQMxE40S offers additional possibilities for I/O connection due to the edge connector with 314 pins. Thus, 3 independent, high-resolution displays (up to 4K / 60 Hz) and 2 Gigabit Ethernet network interfaces are available. An ideal peripheral connection with 3rd generation PCI Express is also supported here (8 GT/s). Two CAN interfaces complete the functionalities. With its dimensions of 82 mm x 50 mm, the TQMxE40S module complies with the new SMARC 2.1 specification (short size) and is supported by the corresponding MB-SMARC-3 motherboard.

The two COM Express Compact modules TQMxE40C1 (soldered memory, max. 16 GB) and TQMxE40C2 (pluggable SO-DIMM memory, max. 64 GB) differ in the memory technology used. Both support up to 8 PCIe lanes and 6 devices as well as 3 independent 4K displays, 2x SATA and 1x Gigabit Ethernet.

The modules are expected to be available in series in Q1/Q2 2021.

For more information, visit: https://www.tq-group.com/en/products/tq-embedded/elkhart-lake/

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Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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