TE Connectivity's New Board-to-Board Stacking Connectors Offer a Way to Upgrade COM Express Applications to 16 GT/s Speeds
February 01, 2021
TE Connectivity introduced a new generation of free height computer-on-module (COM) connectors in 0.5mm centerline to address vertical, parallel board-to-board connections that require high-speed data transmission and different stacking heights. These new connectors are compliant with the COM Express Type 7 specification and can be compatible with the PCIe Gen 4 protocol.
The connectors can support up to 16 giga transmission per second (GT/s), doubling the performance of most previous COM connector generations. They also feature improved signal integrity supported by low insertion loss, return loss, PSNEXT, and PSFEXT, whether using both new receptacles and plugs or mating new receptacles with older plugs.
The connectors support system design flexibility with configuration options in stacking height (5mm, 8mm) and pin positions (220, 440). They can be an economic upgrade solution by keeping the same footprint as other COM standard interconnects. There is commonly no need for customers to change printed circuit board (PCB) footprints when upgrading applications. Per the company, the connectors offer improved mechanical design that can reduce mating and unmating force by about 30% compared to previous generations, allowing for more suitable operation.
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