congatec Launches 20 New Computer-on-Modules with 11th Gen Intel Core Processors

By Tiera Oliver

Associate Editor

Embedded Computing Design

August 05, 2021

News

congatec Launches 20 New Computer-on-Modules with 11th Gen Intel Core Processors

congatec introduced 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules are designed to target demanding IoT gateway and edge computing applications.

Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU and platform controller hub (PCH), the new flagship COM-HPC Client and COM Express Type 6 modules features a new bandwidth benchmark of up to 20 PCIe Gen 4.0 lanes for connected, real-time IIoT gateway and intelligent edge computing workloads.

To process large workloads, the new modules boast up to 128 GB DDR4 SO‑DIMM RAM, integrated AI accelerators, and up to 8 high-performance CPU cores that achieve up to 65% gain [1] in multi-thread performance and up to 32% gain [2] in single-thread performance. Moreover, visualization, auditory, and graphics intensive workloads are enabled with a boost of up to 70% compared to predecessors [3].

Flagship applications that directly benefit from these GPU enhancements can be found in surgery, medical imaging, and e-health edge applications as congatec’s new platform supports 8K HDR videos for optimum diagnostics. Combined with the platform’s AI capabilities and the comprehensive Intel OpenVINO toolkit, doctors can gain access and insights into deep learning based diagnostic data.

The integrated Intel UHD graphics also support up to four 4K displays in parallel. In addition, it can process and analyze up to 40 HD 1080p/30fps video streams in parallel for 360 degree views in all directions. These AI vision capabilities are also important for many other markets, including factory automation, machine vision for quality inspection in manufacturing, safe spaces & cities, as well as collaborative robotics and autonomous vehicles in logistics, agriculture, construction, and public transport.

AI and deep learning inference algorithms can seamlessly run either parallel on the integrated GPU, or on the CPU with built-in Intel Deep Learning Boost that combines three instructions into one, accelerating inference processing and situational awareness.

The new COM-HPC Client and COM Express Type 6 platforms have integrated safety functions that are important for the fail-safe operation of many mobile vehicles and robots, as well as stationary machinery. For real-time support in such applications, the congatec modules can run RTOSes such as Real Time Linux and Wind River VxWorks, and provide native support from Real-Time Systems’ hypervisor technology, which is also officially supported by Intel.

Further real-time capabilities include Intel Time Coordinated Computing (Intel TCC) and Time Sensitive Networking (TSN) for real-time connected IIoT/industry 4.0 gateways and edge computing devices. 

The feature set in detail

The conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm) will be available with new scalable 11th Gen Intel Core, Xeon and Celeron processors, with selected variants even for extreme temperatures ranging from -40 to +85°C. Both form factors support up to 128 GB DDR4 SO-DIMM memory with 3200 MT/s and optional ECC. To connect peripherals with large bandwidth, the COM-HPC modules support 20 PCIe Gen 4 lanes (x16 and x4), and the COM Express versions support 16 PCIe lanes. In addition, designers can leverage 20 PCIe Gen 3 lanes with COM-HPC, and 8 PCIe Gen 3 lanes on COM Express. 

To support ultra-fast NVMe SSD, the COM-HPC module provides 1x PCIe x4 interface to the carrier board. The COM Express board has NVMe SSD even onboard for optimum utilization of all native Gen 4 lanes supported by the new processor. Further storage media can be connected via 2x SATA Gen 3 on COM-HPC, and 4x SATA on COM Express.

Where the COM-HPC module offers latest 2x USB 4.0, 2x USB 3.2 Gen 2, and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. For networking, the COM-HPC module offers 2x 2.5 GbE, whereas the COM Express module executes 1x GbE, with both supporting TSN. Sound is provided via I2S and SoundWire in the COM-HPC version, and HDA on the COM Express modules. Comprehensive board support packages are provided for all leading RTOSes, including hypervisor support from Real-Time Systems as well as Linux, Windows, and Android.

The two 11th Gen Intel Core, Xeon and Celeron processor based COM-HPC and COM Express Basic Type 6 modules are available in the following options:

 

Processor

 

Cores/
Threads

 

Base Freq. (Max Turbo) [GHz]

 

Cache [MB]

 

TDP

 

Temp. Range [°C]

 

Intel Core i7-11850HE

 

8/16

 

2.6/4.7

 

24

 

35/45

 

0 – 60

 

Intel Core i5-11500HE

 

6/12

 

2.6/4.5

 

12

 

35/45

 

0 – 60

 

Intel Core i3-11100HE

 

4/8

 

2.4/4.4

 

8

 

35/45

 

0 – 60

 

Intel Xeon 11865MRE

 

8/16

 

2.6/4.7

 

24

 

35/45

 

-40 - 85

 

Intel Xeon 11555MRE

 

6/12

 

2.6/4.5

 

12

 

35/45

 

-40 – 85

 

Intel Xeon 11155MRE

 

4/8

 

2.4/4.4

 

8

 

35/45

 

-40 – 85

 

Intel Xeon 11865MLE

 

8/16

 

1.5/4.5

 

24

 

25

 

0 – 60

 

Intel Xeon 11555MLE

 

6/12

 

1.9/4.4

 

12

 

25

 

0 – 60

 

Intel Xeon 11155MLE

 

4/8

 

1.8/3.1

 

8

 

25

 

0 – 60

 

Intel Celeron 6600HE

 

2/2

 

2.6

 

8

 

35

 

0 – 60

For more information:

Featured Companies

congatec Inc.

6262 Ferris Square
San Diego, CA 92121

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

More from Tiera