Embedded Executive: Johnson Chen, Executive, Winbond

By Rich Nass

Executive Vice President

Embedded Computing Design

September 08, 2021

News

Embedded Executive: Johnson Chen, Executive, Winbond

The global chip shortage continues to rage on, and it appears to be worsening rather than getting better.

Different people have different reasons for why we are in this predicament, and Johnson Chen, an Executive at Winbond, is no different. Johnson brings a little different perspective, as he spends his time in Taiwan, and is focused on some specific applications, like automotive. Check out what he had to say in this week’s Embedded Executives podcast.

 
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Richard Nass’ key responsibilities include setting the direction for all aspects of OSM’s ECD portfolio, including digital, print, and live events. Previously, Nass was the Brand Director for Design News. Prior, he led the content team for UBM’s Medical Devices Group, and all custom properties and events. Nass has been in the engineering OEM industry for more than 30 years. In prior stints, he led the Content Team at EE Times, Embedded.com, and TechOnLine. Nass holds a BSEE degree from NJIT.

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