ASRock Industrial’s Introduces iEPF-9000S/ iEP-9000E Series Edge AIoT Platform
July 29, 2021
News
ASRock Industrial Computer released the new iEPF-9000S Series/ iEP-9000E Series Ruggedized Edge AIoT Platform powered by Intel 10th Generation Xeon W and Core i7/i5/i3 Processors (Comet Lake), with W480E, Q470E, and H420E chipsets.
Featuring workload consolidation, the new iEPF-9000S Series/ iEP-9000E Series provides suitable computing power, I/Os, expansions under the compact size, and ruggedness to replace traditional machines for PLC, HMI, Motion Control, Machine Vision, and more. The series is also well suited for Edge AI applications, such as smart factories, machine automation, AI vision in automated optical inspection, autonomous vehicles, and more.
There are two types of Ruggedized Edge AIoT Platform for next-level workload consolidation capability in different vertical markets. The iEPF-9000S Series Expendable Edge AIoT Platform is designed with flexible configurations and expansion slots for a variety of expansion cards; the iEP-9000E Series Compact Edge AIoT Platform is space-saving and fan-less in design with passive thermal solution. Both systems are powered by Intel 10th Generation Xeon W and Core i7/i5/i3 Processors (Comet Lake) with W480E, Q470E, and H420E chipsets for suitable computing power. Both systems also support a total of four DDR4 SO-DIMM sockets up to 128GB, an upgrade of memory size for Edge AI applications.
The iEPF-9000S Series/ iEP-9000E Series support up to five Intel Gigabit LAN with two supporting PoE for connectivity, four USB 3.2 Gen2, three USB2.0, six COM (4 x RS-232/422/485, 2 x RS-232), eight DI/DO (support 2.5KV isolation), and visual through triple displays with two Display Port and one VGA, plus four SATA3 with hot swap trays for 2.5-inch SSD or HDD (CFast Option). Designed with flexible expansion slots, the iEPF-9000S Series supports one PCIe x16 (Gen 3) or two PCIe x8 (Gen 3), and two PCIe x4 for a variety of expansion cards such as graphic card, frame grabber card, motion card, and IO card. In addition, there are various sockets for RF modules and storage, one M.2 Key M for NVMe/ SATA SSD, one M.2 Key B for 4G/ 5G, one M.2 Key E for Wi-Fi/ BT, and two Mini PCIe for option modules.
The iEPF-9000S Series includes models iEPF-9000S-EX4, iEPF-9001S-EX4, and iEPF-9002S-EX4 and is space-saving in design- 202 x 290 x 209.3mm (W x D x H); the iEP-9000E Series’ available models are iEP-9000E, iEP-9001E, and iEP-9002E with compact size- 202 x 244 x 108.7mm (W x D x H). Moreover, featuring rugged design, the new Series supports DC 9~36V wide range power input with ignition control and remote power switch, with 80V surge protection, OVP, UVP, OCP, and reverse protection, and can also work under -40°C~75°C (-40°F~167°F) wide range temperature, plus high shock and vibration resistance to ensure always-on functionality even in harsh environments.
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Edge AIoT Platform |
iEPF-9000S Series |
iEP-9000E Series |
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Intel® W480E |
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Intel® Q470E |
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Intel® H420E |
For more information, visit: www.asrockind.com/en-gb/ruggedized-edge-aIoT-platform
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
