Smart Equipment Technology (SET) Introduces New Automatic Flip-Chip Bonder for Device Production
December 02, 2019
Smart Equipment Technology, a supplier in die-to-die and die-to-wafer bonders, announced the release of NEO HB, an automatic flip-chip bonder.
Smart Equipment Technology, a supplier in die-to-die and die-to-wafer bonders, announced the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM).
The first of a new line of SET flip-chip bonders dedicated entirely to production, the tool combines precision, flexibility, short cycle time, and creative design. It was developed in collaboration with CEA-Leti as part of IRT Nanoelec's 3D integration program.
Séverine Chéramy, director of IRT Nanoelec's 3D integration program, said the objective when SET joined the consortium was to provide IC designers with 3D die-to-wafer stacking at an aggressive pitch - less than 10µm - at high speed, at room temperature, and without pressure or underfill.
Hughes Metras, the recently appointed director of Nanoelec, said the institute's collaboration with SET demonstrates both the success of its mission of technology development and transfer and the strength of its 3D integration program.
For more information, visit http://www.irtnanoelec.fr/en/