Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
July 07, 2021
News
Presto Engineering and Cadence Design Systems announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets
Presto is adopting the Cadence system design and analysis portfolio for advanced IC packaging, which includes the Cadence Allegro X Package Designer Plus, Clarity 3D Solver, Sigrity XtractIM technology, and Celsius Thermal Solver, on an exclusive basis in order to design IC packaging solutions for its automotive and IoT customers. In addition, Presto plans to provide Cadence with input on software features, functions, and workflows specific to Cadence's end customer and market needs.
SiP and 3D packages, especially those with high-reliability requirements, tend to require multiple spins in order to optimize the bill of materials and design tolerances, as well as to achieve full control of the chip's performance reproducibility. Cadence solutions, coupled with manufacturing knowledge and planning during the design process, are designed to help to reduce design spins and speed time to market.
Presto's ability to provide a suite of analytical qualification services within a single facility is also designed to further reduce the time to market for its customers. The Cadence system design and analysis portfolio for advanced IC packaging supports Cadence's Intelligent System Design strategy, enabling SoC design. Now, with the addition of the Cadence portfolio, Presto offers a set of design and qualification tools to help customers achieve an efficient design-for-manufacturing (DFM) process.
For more information, visit: cadence.com or presto-eng.com
