New Vishay Intertechnology ThermaWick SMD Thermal Jumper Chip Removes Heat From Electrically Isolated Components

By Tiera Oliver

Associate Editor

Embedded Computing Design

April 07, 2020

News

The Vishay Dale Thin Film device allows designers to transfer heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.

Vishay Intertechnology, Inc. introduced the ThermaWick THJP series surface-mount thermal jumper chip. The Vishay Dale Thin Film device allows designers to transfer heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.

Featuring an aluminum nitride substrate with high 170 W/m°K thermal conductivity, the chip is capable of reducing the temperature of connected components by over 25 %, according to the company. This reduction allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions while maintaining the electrical isolation of each component. By protecting adjacent devices from thermal loads, overall circuit reliability is improved.

The THJP's low capacitance down to 0.07 pF makes it an ideal choice for high frequency and thermal ladder applications. The thermal conductor will be used in power supplies and converters, RF amplifiers, synthesizers, pin and laser diodes, and filters for AMS, industrial, and telecommunications applications.

The device is available in six case sizes from 0603 to 2512, with custom sizes available. The 0612 and 1225 cases feature long side terminations for additional heat transferring capability. The thermal jumper is available with lead (Pb)-bearing and lead (Pb)-free wraparound terminations.

Samples and production quantities of the ThermaWick THJP series thermal jumper are available now, with lead times of six weeks.

For more information, visit: http://www.vishay.com/

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Vishay Intertechnology

63 Lancaster Ave
Malvern, Pennsylvania 19355

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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