embedded world 2017: FTDI Chip makes USB-to-Serial Conversion Count in Mobile Device Design

March 15, 2017

Gavin Moore of FTDI Chip explains to Brandon Lewis, Technology Editor at Embedded Computing Design, how the power and form factor constraints of USB-to-serial offerings can make or break a mobile design at embedded world 2017, Hall 4A, stand 326.

 
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embedded world 2017: Day Zero

embedded world 2017: Day Zero

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