ADLINK Will Showcase Edge AI Strategy and Next-Gen Modules at embedded world 2021
February 23, 2021
News
ADLINK joins embedded world digital 2021 to showcase its edge AI strategy. ADLINK will have demonstrations, roundtables, and expert live Q&A sessions throughout the show.
ADLINK will feature next-gen modules and platforms with chipmakers NVIDIA, Intel, NXP, and AMD, including:
- AI-on-Modules (AIoM) for use in demanding graphics-based applications such as AI and deep learning inferencing at the edge, ultrasound image processing, and video encoding/streaming. Including ADLINK’s COM Express Modules supporting AMD Ryzen Octa- and Hexa-Core V2000 APUs (cExpress-AR), and Intel’s 11th Gen Core processor family (cExpress-TL).
- ADLINK’s new I-Pi SMARC IMX8M Plus Starter Kits and new one-stop design-and-order carrier board service with Gepetto
- GPU-based deep learning acceleration platforms (DLAP) for deploying AI at the edge across industrial applications based on NVIDIA Jetson and Quadro
ADLINK experts will also co-present on joint edge AI topics and solutions within AWS and Intel’s virtual booth. ADLINK partner Data Spree will be available in ADLINK’s virtual booth to share machine vision AI success stories and use cases in driving the edge together. For researchers and developers in the automation, automobile, and electronics industries, embedded world digital 2021 offers an opportunity to connect with ADLINK computing engineers and innovation leaders live.
For more information, visit: https://www.adlinktech.com/en/Index.aspx
