AI & Machine Learning
The Road to embedded world: Ceva to Bring Physical AI to Life
February 19, 2026
Visitors to Booth 4-462 at embedded world Germany will get to view demonstrations from Ceva showcasing its AI Fabric, a unified foundation of connectivity, sensing, and inference IP that powers intelligent, autonomous edge systems. The integrated architecture facilitates scalable, power-efficient Physical AI across consumer, industrial, automotive, and infrastructure applications.
Software & OS
From IDEs to Integrated Suites: Embedded Development Tools Are Evolving Again
February 19, 2026
For decades, embedded development has followed a fairly predictable path.
Processing
Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 FPGA Module at embedded world’ 26, Germany
February 18, 2026
Sundance will present a compact, low-power system-on-module for FPGA/DSP-intensive applications at embedded world 2026 at the OpenSystems Media stand - Hall 1, Booth 1-500.
Industrial
The Road to embedded world: AntennaWare Launches First Low-Profile Alternative to Monopole Antennas
February 18, 2026
According to AntennaWare, during embedded world Germany (Hall 3, Booth 3-423), the company will launch the first viable low-profile alternative to monopole antennas for Sub-GHz (868/915 MHz) applications thereby eliminating the trade-off between form factor and performance.
Security
The Road to embedded world: PQShield Advances Post-Quantum Cryptography
February 17, 2026
PQShield (Booth 4-378) will attend embedded world Germany to showcase its post-quantum cryptography for embedded hardware including its quantum-safe secure boot, side-channel protection against physical attack, and PQC-secure TLS.
Industrial
Energy Management Is Harnessed Thanks To iAMT On the Right Embedded Computing Platform
February 17, 2026
Energy management, in the context of digital energy and the smart grid, refers to the monitoring, control, and optimization of energy generation, distribution, and consumption using (digital) data-driven and automated technologies. It extends beyond traditional analog/power system operation by integrating real-time measurements, advanced analytics, and intelligent control across the entire system, whether that system is within a box, within a building, or within a city. And it includes the complete chain from generation to consumption.
AI & Machine Learning
Taiwan Excellence Showcases AI Breakthroughs at embedded world 2026
February 17, 2026
As the largest foreign exhibitor at embedded world 2026 in Nuremberg from March 10 to 12, Taiwan will present a broad range of AI-driven innovations in electronics and computing. The show opens on Tuesday, March 10, with the Taiwan Excellence Product Launch Event, where leading Taiwanese technology companies will introduce next-generation AI applications designed for embedded and edge environments.
IoT
Choosing the Right Silicon for Edge AI: How Intel, AMD, NVIDIA, and Arm Are Shaping the Next Generation of Distributed Computing
February 17, 2026
Edge computing devices, from retail cameras to factory controllers and logistics endpoints, are rapidly becoming frontline AI systems. The modern edge stack blends CPUs, GPUs, and increasingly NPUs (neural processing units) to deliver low‑latency, on‑device intelligence. This article compares how Intel, AMD, NVIDIA, and Arm pursue edge AI differently and offers CIOs a practical decision framework to align silicon, thermals, and software ecosystems with real workloads and operating constraints.
Storage
The Road to embedded world: BIWIN Highlights TAU208 UFS 3.1 Automotive Storage
February 13, 2026
During its stay at embedded world Germany 2026, BIWIN Storage Technology Co., Ltd. (BIWIN) will be in Booth 1-140 demonstrating its BIWIN TAU208 UFS 3.1 automotive-grade storage designed for performance and reliability in harsh environments.
IoT
The Road to embedded world: Discover Vecow’s AI PC Revolution and Robotics Supercomputers
February 12, 2026
Vecow will attend embedded world Germany and invites visitors to Hall 3, Stand 3-259 to see its Edge AI demonstrations under the theme "Powering the Future of Intelligence". On display will be high-performing AI engines driven by the latest Intel, NVIDIA, and Qualcomm technology.
IoT
The Road to embedded world: MiTAC Showcases Scalable Industrial Edge Computing Solutions for AI Workloads
February 11, 2026
MiTAC Digital Technology (MDT) Corp. will exhibit its portfolio of industrial Edge computing products engineered to support modern data processing and AI workloads during embedded world Germany between March 10–12, 2026. MiTAC’s booth location will be Hall 3 Stand 3-358 where the company will demonstrate the way its solutions are designed to enable flexibility in how software and system architectures are implemented.
Processing
The Road to embedded world: Enclustra Highlights Andromeda RFSoC, AMD Versal SoC, and Edge AI Solutions
February 10, 2026
Enclustra will be located at Booth 3A-331 during this year's embedded world Germany where it will highlight its next-generation FPGA and SoC innovations. The booth will host an interactive Enclustra Product Wall, highlighting the latest Andromeda RFSoC and SoC modules, including the powerful Andromeda XRU50, the newly introduced XRU30 for scalable, high-performance RF applications, and the Andromeda XVE70 based on AMD Versal SoC for advanced edge AI and signal processing.
Open Source
Mouser Product of the Week: NXP Semiconductors' FRDM-MCXE31B Development Board
February 9, 2026
Rapid prototyping is a critical step in the development of modern motor control, industrial automation, and general-purpose embedded systems. Embedded engineers, software developers, and hardware designers must ensure products are ready for deployment, with the support of powerful and flexible testing and implementation solutions.
Processing
Solectrix to Introduce its proFRAME Base Board 3.1 PXIe Targeting Aerospace, Automotive, and Railway Test Applications at embedded world Germany
February 18, 2026
Fürth, Germany. Solectrix will introduce its proFRAME Base Board 3.1 PXIe for the PXI Express standard at this year’s embedded world in Germany. The solution is a 3U module using the PXI Express Gen 3 x8 bus with support for streamlined integration into National Instruments’ LabVIEW platform into current systems.
AI & Machine Learning
Multimedia
Teaching & Investing in the Next-Generation of Engineers
February 19, 2026
In this episode of Embedded Insiders, Marilyn C. Wolf, professor of Engineering at the University of Nebraska-Lincoln, joins the podcast to discuss the importance of students understanding scope, having a balanced understanding of both hardware and software, and the needs of today’s engineering workforce.
Analog & Power
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Mouser Product of the Week: Analog Devices’ EVAL-LTC7899-AZ Evaluation Board
January 12, 2026
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Optimizing LDO Headroom Control with a Current Referenced Switching Regulator Design—Part 1: Noise Sources, Impact, and Strategies
December 02, 2025
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Product of the Week: Bicker Elektronik GmbH DC401W DC-ATX Power Supply
December 01, 2025
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iDEAL’s SuperQ MOSFET Delivers 800A SCWC, Redefining Safety in 72V+ Battery Systems
November 25, 2025
AI & Machine Learning
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Teaching & Investing in the Next-Generation of Engineers
February 19, 2026
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DevTalk with Rich and Vin: The Vital Connection Between Industry and Academia
February 17, 2026
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Taiwan Excellence Showcases AI Breakthroughs at embedded world 2026
February 17, 2026
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Circuit Mind Study Finds AI Automation Driving Measurable Gains in Circuit Design Efficiency
February 12, 2026
Automotive
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Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
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New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
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Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
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SOAFEE Blueprint: Enabling AI-Native, Offline-Resilient Vehicle Software with mimik
January 15, 2026
IoT
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Industry Acquisitions, Connectivity, IoT, AI, and Embedded Trends For 2026
February 12, 2026
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The Road to embedded world: Discover Vecow’s AI PC Revolution and Robotics Supercomputers
February 12, 2026
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Virscient to Present Cutting-Edge Wireless Connectivity and Audio Technologies at embedded world Germany
February 11, 2026
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The Road to embedded world: MiTAC Showcases Scalable Industrial Edge Computing Solutions for AI Workloads
February 11, 2026
Networking & 5G
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Embedded Executive: Wireless Charging Just Got Faster | WPC
January 14, 2026
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Embedded Executive: Everything You Need To Know About Wi-Fi | Infineon
January 07, 2026
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Deploy Channel Sounding In Your Bluetooth Devices
December 16, 2025
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Taoglas Expands Low-Cost, Compact Chip Antenna Range for Wi-Fi 6/7, UWB, and ISM Applications
December 02, 2025
Open Source
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Mouser Product of the Week: NXP Semiconductors' FRDM-MCXE31B Development Board
February 09, 2026
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At embedded world 2026, Linutronix to Present IGLOS Secure Industrial Grade Linux OS
February 04, 2026
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Create a Cost-Effective HMI With LVGL (and Some Help From Renesas)
January 26, 2026
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RISC-V International: Becoming ISO and The Future of Open Computing
January 22, 2026
Security
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STM32 OTA Firmware Update
February 04, 2026
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Embedded Executive: The Latest On the Chips Act | PQSecure
February 04, 2026
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PX5 NET Gains TÜV Approval, Enabling Faster Certification of Safety-Critical Embedded Applications
January 22, 2026
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New RunSafe Security Report: Engineering Leaders Brace for Rising Cyber Risks in Embedded AI
December 11, 2025
HPC/Datacenters
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A Comprehensive Digital Twin Environment and Semiconductor Lifecycle Management Can Ensure Reliable Data-Center Operations
November 24, 2025
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The Power Problem Behind AI Data Center Performance
November 11, 2025
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NODKA Leverages Intel Power for Industrial HPC Applications
November 06, 2025
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Meeting the Demanding Energy Needs of AI Servers with Advanced Technology
October 23, 2025