Automotive Embedded Systems
 
 
JANUARY 2019
 
 
 
 
FEATURE
 
 
 
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MAJEED AHMAD, CONTRIBUTING EDITOR
 
The autonomous car movement is about to face another roadblock: a battle over the connectivity standard between the 5G-based cellular vehicle-to-everything (V2X) communications and the ITS-G5 technology based on Wi-Fi connectivity.
 
 
 
 
 
 
NEWS
 
 
 
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LAURA DOLAN, TECHNOLOGY EDITOR
 
Vector?s vVIRTUALtarget virtually tests AUTOSAR ECUs, producing software development implementations faster in standard AUTOSAR-4 projects, making it easier to test the ECU software during the development process.
 
 
 
 
 
 
NEWS
 
 
 
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LAURA DOLAN, TECHNOLOGY EDITOR
 
Renesas Electronics Corporation introduced its new automotive-grade 100V, 4A half-bridge N-channel MOSFET drivers, the ISL784x4 family, which features three devices.
 
 
 
 
 
 
NEWS
 
 
 
 
LAURA DOLAN, TECHNOLOGY EDITOR
 
Western Digital Corp. has introduced the first 3D TLC NAND automotive embedded UFS flash drive (EFD). The Western Digital iNAND AT EU312 EFD was inspired by the UFS 2.1 interface delivering high capacities and up to 2.5 times the performance of the company?s previous e.MMC-based products.
 
 
 
 
 
NEWS
 
 
 
 
LAURA DOLAN, TECHNOLOGY EDITOR
 
Microchip Technology?s new family of single-chip maXTouch touchscreen controllers addresses the design of modern automotive capacitive touch systems and improves the touch interface performance for screens up to 20 inches.
 
 
 
 
 
NEWS
 
 
 
 
LAURA DOLAN, TECHNOLOGY EDITOR
 
According to LDRA, Renishaw has certified its RESOLUTE FS optical encoder system to meet level SIL 2 in accordance with IEC 61508-1:2010 by successfully implementing the LDRA tool suite.
 
 
 
 
 
NEWS
 
 
 
 
LAURA DOLAN, TECHNOLOGY EDITOR
 
LDO40L is AEC-Q100 qualified with 45?A quiescent current and diminishes the need for vehicle batteries to run loads while the ignition is off. The device can also be deactivated to achieve a very-low shutdown current of only 1?A.
 
 
 
 
 
NEWS
 
 
 
 
LAURA DOLAN, TECHNOLOGY EDITOR
 
DENSO Corporation will attend the Consumer Electronics Show (CES) in Las Vegas, Nevada, at the Las Vegas Convention and World Trade Center (LVCC), North Hall, booth #4619, from January 8-11, 2019 to demonstrate the future of mobility with its latest technology breakthroughs.
 
 
 
 
 
SPONSORED ARTICLE
 
 
 
MICROCHIP
 
MICROCHIP TECHNOLOGY INC.
 
In automotive applications, the typical Local Interconnect Network (LIN) node has a limited set of functions such as monitoring mechanical switches or touch buttons on a steering wheel and sending the information to the connected LIN master. For tasks like these that involve minimal computing, the primary design factors are low cost and size constraints. However, as multiple Embedded Control Units (ECUs) are being integrated into modern cars, power consumption for each module needs to be optimized.
 
 
 
 
 
 
SPONSORED ARTICLE
 
 
 
MICROCHIP
 
MICROCHIP TECHNOLOGY INC.
 
If you are developing an application that includes a Controller Area Network (CAN) system, you know that software development can slow you down. You can now change the way you design with CAN using Microchip?s new PIC18 K83 family of microcontrollers (MCUs). These two new devices combine a CAN bus with an extensive array of Core Independent Peripherals (CIPs).
 
 
 
 
 
 
 
 
Sponsored by: RTI
Date: January 10, 2:00 p.m. ET
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