Embedded Computing Design

Industry News

IoT
Renesas Introduces New “Lab on the Cloud” Environment for Access to Application Solutions

Tiera Oliver

January 21, 2021

Analog & Power
Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology

Tiera Oliver

January 21, 2021

AI & Machine Learning
Sensory’s VoiceHub Lets Anyone Add a Natural Language UI to Anything

Tiera Oliver

January 21, 2021

Debug & Test
Rohde & Schwarz Offering First Validated IMS Conformance Test Cases for 5G NR

Perry Cohen

January 21, 2021

Open Source
SEGGER J-Link Debugger Now Found on HiFive Inventor Coding Kit

Perry Cohen

January 21, 2021

Storage
Transcend Launches New CFexpress Type B Card Reader RDE2 and CFexpress 820 Type B Memory Card

Tiera Oliver

January 21, 2021

Automotive
$52 Billion Market for EV Battery Cell and Pack Materials Forecast by IDTechEx

Tiera Oliver

January 21, 2021

Security
OMG Issues RFP to Standardize Linked Encrypted Transaction Streams (LETS)

Perry Cohen

January 20, 2021

Industrial
Industrial Internet Consortium Releases RFP Toolkit

Perry Cohen

January 19, 2021

Open Source
Avnet's HoriZone RA Development Kit and IoTConnect Platform Bring Real-time IoT Sensor Data to the Cloud

Tiera Oliver

January 19, 2021

AI & Machine Learning
CEA-Leti Scientists Demonstrate Machine Learning Technique Exploiting RRAM Devices

Perry Cohen

January 19, 2021

Healthcare
InnovationLab and Bitquadrat Demonstrate Smart Mattress Cover for Real-Time Patient Monitoring

Tiera Oliver

January 19, 2021

Automotive
Versinetic Launches Charging Blox to Accelerate EV Charge Point Rollout

Tiera Oliver

January 19, 2021

Automotive
OmniVision and Nextchip Partner on Automotive Viewing Camera Solution for Low-End and Midrange Vehicles

Tiera Oliver

January 18, 2021

OmniVision and Nextchip announced during CES a joint solution that is pre-tuned to provide high quality images for rearview cameras (RVCs), surround-view systems (SVS), and e-mirrors in low-end and midrange vehicles.
Analog & Power
New Vishay Intertechnology Through-Hole Inductor Packs a 420 A Saturation Current into 1500 Case Size

Tiera Oliver

January 18, 2021

Vishay Intertechnology introduced a new through-hole inductor designed to deliver a 420 A saturation current for 30 % inductance reduction in a 1500 case size.
Analog & Power
Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology

January 21, 2021

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Automotive
$52 Billion Market for EV Battery Cell and Pack Materials Forecast by IDTechEx

January 21, 2021

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Consumer
The Royal Air Force and the Invention of the Modern Touchscreen

January 14, 2021

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Security
The Place for MISRA C in Safe & Secure Programming - A Comparison with SPARK

January 21, 2021

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