European Research Institute Chooses Veeco MOCVD Platform for Wireless AND Broadband Communication Applications

By Tiera Oliver

Assistant Editor

Embedded Computing Design

August 13, 2020

News

The TurboDisc platform provides production ramping due to recipe capabilities up to 50% quicker than when using traditional batch tools.

Veeco Instruments Inc announced that IHP Microelectronics, based in Frankfurt, Germany, has selected Veeco’s TurboDisc metal organic chemical vapor deposition (MOCVD) system for the development of silicon-based microelectronic technologies.

IHP is a research and development institute focused on silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication.

According to the company, Veeco’s TurboDisc platform has been the foundation of Veeco’s compound semiconductor materials science leadership. The proprietary technology is a key enabler for demanding As/P and GaN applications for next-generation communications infrastructure and efficient microelectronic devices.

Also, per the company, the TurboDisc platform provides production ramping due to recipe capabilities up to 50% quicker than when using traditional batch tools. In addition, the platform also includes Veeco’s IsoFlange and SymmHeat technologies, which provide homogeneous laminar flow and uniform temperature profile across the entire wafer.

For more information, visit www.veeco.com or https://www.ihp-microelectronics.com/en/start.html

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Tiera Oliver, Assistant Editor for Embedded Computing Design, is responsible for web content edits and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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