Heraeus? Direct Copper Bonding Tech Increases Lifetime In Power Electronics

May 03, 2019

Heraeus? Direct Copper Bonding Tech Increases Lifetime In Power Electronics

Heraeus Electronics announced that its Condura product line has been enhanced with features for Direct Copper Bonding (DCB) substrates.

Heraeus Electronics announced that its Condura product line has been enhanced with features for Direct Copper Bonding (DCB) substrates, to extend the lifetime of power electronics modules. Additional services include an optimized design along with a dimpled etched recessed surface treatment to increase the service life of DCB substrates, and grinding, a mechanical surface treatment to create optimized properties.

The structure of the surface must be able to accommodate the formulation and bonding technique used. “A very rough surface can lead to poorer connections during wire bonding,” explained Bastian Schlüter, Product Manager for Metal-Ceramic Substrates at Heraeus Electronics. Heraeus offers various degrees of roughness that reduce unevenness and ensure the proper surface.

For more information, visit www.heraeus.com.

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