COMPUTEX Taipei preview: Winmate launches dry optical bonding process

May 26, 2015

COMPUTEX Taipei preview: Winmate launches dry optical bonding process

Winmate announced their new investment in state-of-the-art laboratories to enable their launch of a new dry optical bonding process, in addition to th...

Winmate announced their new investment in state-of-the-art laboratories to enable their launch of a new dry optical bonding process, in addition to the existing liquid-based method. Dry optical bonding (also known as “optically clear adhesive,” or OCA) swaps liquid ‘glue’ for a rolled sheet of optically transparent adhesive film, improving manufacturability and slashing costs to the customer.

The benefits of optical bonding are now well publicised, particularly by Embedded Computing Design, whom recently covered the technology in our “(Optical) bonding with your panel PC” report. To summarise, key benefits are reducing sunlight illegibility due to reflection, preventing condensation, and improving the overall ruggedness of the display.

Rory Dear, European Editor/Technical Contributor
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