New bonding technology for high-volume projects: DATA MODUL is a pioneer of hybrid bonding
July 26, 2019
DATA MODUL is extending its offer of bonding technologies with an additional process: hybrid bonding.
Munich, July 23, 2019. The demand for touch displays for the professional/industrial sector is also continuing to grow constantly. In order to meet this growing and very different demand, such as for quantities, diagonals, technology etc., DATA MODUL is extending its offer of bonding technologies with an additional process: hybrid bonding.
This technology is new to the market and DATA MODUL is one of the first providers for the industry in Europe. Since May 2019 at the Weikersheim production site, the display expert has successfully implemented and put into operation a fully automatic hybrid bonding machine in the extended clean room. In the classic bonding process, touch, glass and display are bonded (fully) automatically with a liquid or dry glue, and finally cured. Hybrid bonding, however, is an advanced combination of proven LOCA (liquid) and OCA (dry lamination) technologies. The benefits of the two classic methods have thereby been combined and increased. From a budget perspective and due to its set-up times hybrid bonding is particularly well suited for high volume projects. With this process, the Munich-based display expert expands its range of display optimization options for industrial customers and offers the greatest variety of bonding methods in-house.
In the near future, DATA MODUL will also invest in additional OCA and LOCA bonding machines at the production site. DATA MODUL will thereby ensure the greatest flexibility in production for industrial projects.
More information about all bonding technologies can be found under: https://www.data-modul.com/optical-bonding.