Toshiba Memory America's BiCS FLASH-Enabled UFS is the Latest Edition to Flash Memory Products for Automotive Applications
April 01, 2019
Toshiba Memory America, Inc. has started sampling new Automotive UFS JEDEC Version 2.1 embedded memory solutions that combine BiCS FLASH 3D flash memory and a controller in a single package.
SAN JOSE, CA. Toshiba Memory America, Inc. has started sampling new Automotive UFS JEDEC Version 2.1 embedded memory solutions that combine BiCS FLASH 3D flash memory and a controller in a single package.
The new UFS devices key features include:
1. Extended Temperature Range: Supports -40°C to +105°C. Also meets AEC-Q100 Grade2 specifications.
2. Wide Capacity Range: Supports 32GB to 256GB for automotive applications such as entertainment and information systems and ADAS.
3. High Performance: 256GB product’s sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over previous generation devices.
4. Functions Well-Suited for Automotive Applications: Supports functions such as Refresh, Thermal Control and Extended Diagnosis.
“Due to the significant performance improvements it brings, UFS has become the mainstream solution for high-end and mid-tier smartphones,” said Toshiba Memory America, Inc’s, director of managed flash memory products, Scott Beekman. “It’s only natural that automotive applications follow the same course. Our long history in UFS – we were the first to introduce it back in 2013 – puts us in a unique position to anticipate and support evolving applications to enable these types of transitions.”
For more information, visit business.toshiba-memory.com.