Embedded Computing Design

Technology - Processing - Page 37

Photo Courtesy of RAKwireless
RAKwireless releases 14 new WisBlock Modules

Chad Cox

July 20, 2021

Processing
u-blox Introduces Dual-Output Automotive Dead Reckoning Modules Qualified for Operation Up to 105 °C

Tiera Oliver

July 23, 2021

Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution

Taryn Engmark

July 22, 2021

Product of the Week: NVIDIA QUADRO RTX 6000

Embedded Computing Design Staff

July 21, 2021

Microchip Announces Production Shipments of NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters

Tiera Oliver

July 21, 2021

Renesas Launches R-Car Gen3e for Automotive Infotainment, Cockpit, and Digital Cluster Systems

Tiera Oliver

July 20, 2021

Hybrid Innovations for Processor Architecture Exploration

Deepak Shankar

July 20, 2021

Classic DSP, New Neural Networks & Better Benchmarks Improve Local Voice Activation at the Edge

Tiera Oliver

July 19, 2021

Photo Courtesy of the Company
Atmosic and Globalscale Technologies Announce New Bluetooth Low Energy Module

Chad Cox

July 15, 2021

Photo Courtesy of Sondrel
Sondrel's SFA 100 IP platform for the Edge

Chad Cox

July 15, 2021

STMicroelectronics Eases Connected-Sensor Design with User-Friendly Workspace for BlueNRG SoCs

Chad Cox

July 14, 2021

Weebit Completes Design and Tape-Out of Embedded ReRAM Module

Tiera Oliver

July 14, 2021

Photo Courtesy of ICP Germany
Retrofit ATX Mainboard

ICP Germany

July 14, 2021

Photo Courtesy of Jeremy Cook
Getting Started With a 128x64 Pixel SSD1306 OLED Display

Jeremy S. Cook

July 12, 2021

(Image Courtesy of Texas Instruments)
Texas Instruments Announces New MCU Portfolio

Tiera Oliver

July 12, 2021

An Easier, Lower Cost Path to Customizable SoCs

Jeff DiCorpo

July 8, 2021

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Tiera Oliver

July 7, 2021

Embedded Executive: Jeff DiCorpo, SVP Business Development, efabless

Rich Nass

July 7, 2021

Product of the Week: Rohde & Schwarz RTO6 Series Oscilloscopes

Embedded Computing Design Staff

July 6, 2021

Weebit Nano Demonstrates Integration of Selector with ReRAM Cell for Stand-Alone Memory Market

Tiera Oliver

July 6, 2021

Unlocking the Full Potential of Edge Workload Consolidation

Dan Demers

July 6, 2021

The COM-HPC Spec is Here and Products Are Starting to Emerge

Rich Nass

July 5, 2021

Image Courtesy of Datasheet
Scaling AI Hardware for Smart Vision Applications

Saumitra Jagdale

July 5, 2021

The SoC Evolution: From Early Handsets To Edge Intelligence

Asem Elshimi

June 30, 2021

Photo Courtesy of Mirabilis
Power Modeling and Estimation in Early System Design, Part 2

Deepak Shankar

June 28, 2021

Power Modeling and Estimation in Early System Design, Part 1

Deepak Shankar

June 28, 2021

Phot Courtesy of TQ
TQ Released An Embedded Module and SBC Based on ARM Cortex A53 Processor NXP i.MX 8M Plus

Chad Cox

June 28, 2021

New Lattice CertusPro-NX FPGAs Offer the Size, Power, and Speed Needed for Edge Applications

Rich Nass

June 28, 2021

Photo Courtesy of the Company
TQ-Embedded presents new Computer-on-Module: TQMaRZG2x

TQ-Group

June 28, 2021

Why Raspberry Pi's RP2040 is the Popular Choice for Development Boards

Saumitra Jagdale

June 26, 2021

Analog & Power
Caption: Both the Raspberry Pi Pico and my Pico Touch 2 board use .8mm PCBs / Image Credit: Jeremy Cook
Why You Should Consider .8mm PCBs Versus 1.6mm

April 12, 2024

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Networking & 5G
Fibocom’s 5G Premium Smart Module SC171 Awarded Best in Show by Embedded Computing Design at Embedded World 2024

April 16, 2024

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Processing
The Evolution of Processor Cores, and Embedded World 2024

April 18, 2024

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Software & OS
Image Credit: SYSGO
SYSGO Supports RISC-V with its Embedded Linux ELinOS Version 7.2

April 17, 2024

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