Why Metrology is the Key to Intel's "Angstrom Era"

Joe Cestari

August 6, 2021

SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications

SmartDV? Technologies

August 3, 2021

Bringing Down the Duration of Hardware Design Life Cycle for Compact High Performing Architecture

Saumitra Jagdale

August 3, 2021

Imagination opens Cambridge office

August 3, 2021

Classic DSP, New Neural Networks & Better Benchmarks Improve Local Voice Activation at the Edge

Tiera Oliver

July 19, 2021

Unlocking the Full Potential of Edge Workload Consolidation

Dan Demers

July 6, 2021

Power Modeling and Estimation in Early System Design, Part 1

Deepak Shankar

June 28, 2021

SiFive Performance P550 Core Sets New Standard as Highest Performance RISC-V Processor IP

Tiera Oliver

June 22, 2021

Product of the Week: Cadence Spectre FX FastSPICE Simulator

Embedded Computing Design Staff

June 22, 2021

SmartDV Joins the Xilinx Partner Program

SmartDV

June 21, 2021

Xilinx-Compliant Design IP Accessible to Xilinx Customers through Partner Program

Sondrel Launches the Fourth IP Platform, SFA 350A, for ADAS ASICs

Tiera Oliver

June 3, 2021

AImotive Launches aiWare4 Featuring Advanced Wavefront Processing, Upgraded Safety, and Low-Power For Automotive AI

Tiera Oliver

June 1, 2021

Sondrel Reference IP Enables HPC SoCs While Reducing Cost and Design Time by 30 Percent

Brandon Lewis

May 18, 2021

Sondrel has added the SFA 300 reference design to its semi-custom SoC IP portfolio. Consisting of four-CPU clusters featuring 4 TOPS per channel of AI processing and 400 GOPS per channel of DSP performance, clusters can be daisy chained via the PCIe interface to create HPC solutions. The IP reuse solution enables the creation of differentiated AI, 8K video, blockchain, data analytics, and other high-performance data processing solutions by integrating customer-specific IP such that design time and cost can be reduced by up to 30 percent.

Armv9 Debug & Trace Support Added to Lauterbach TRACE32 Tool Suite

Brandon Lewis

May 10, 2021

CAE Records Record Growth, Despite the Pandemic

Perry Cohen

March 31, 2021

Servotronix Partners with STXI Motion to Release softMC Compact Microcontroller

Perry Cohen

March 12, 2021

Considering eFPGA? Here’s What You Need to Know First

Andy Jaros

March 12, 2021

Lattice Semiconductor Releases New Version of mVision for Embedded Vision Systems

Perry Cohen

March 10, 2021

Espressif Providing Support for the AIoT Market with its Dual-Core ESP32-S3

Saumitra Jagdale

March 5, 2021

Collabora Adds HEVC/H.265 to NXP’s i.MX 8M

Brandon Lewis

March 3, 2021

Support for the IP is enabled via the aforementioned kernel driver and through a userspace component that can be accessed using frameworks like FFMPEG and GStreamer.

Embedded world 2021 Conference Session: Impact of the 3rd Edition of IEC 61508-1/-2 on Your Development

Perry Cohen

February 10, 2021

Lattice Announces Training Center for Award-Winning FPGAs and Solution Stacks

Lattice Semiconductor

January 20, 2021

Created in Partnership with Leading European FPGA Consulting Firm, Lattice Education Competence Center to Focus Exclusively on Lattice Technologies

ROHM Releases BR24H-5AC Series of I2C Bus EEPROMs

Perry Cohen

January 18, 2021

ROHM released the BR24H-5AC series, a 125°C operation compatible I2C bus EEPROMs. Its purpose is to target applications that require data storage under harsh environments.

SmartDV Announces New Line of Design IP Controllers for High-Speed Communications

Tiera Oliver

December 14, 2020