TDK Corporation introduces the MIPI Standard SoundWire microphone for mobile, IoT and other consumer devices. This multimode microphone provides advanced feature sets with very low power.

The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM). The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can transition back and forth without audio glitches.

SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire integrates audio and control data for up to 11 devices (e.g. 7mics, 4 speakers) on a single bus.

T5808 is currently in mass production and will be available through distribution in Q1 2020.  For samples and additional information, please contact [email protected] or visit www.invensense.tdk.com/products/digital/t5808/

Glossary

• HQM: High Quality Mode
• LPM: Low Power Mode
• CCM: Concurrent Mode
• AOP: Acoustic Overload Point

Main applications

• Smartphones
• Microphone Arrays
• Tablets
• Cameras
• Bluetooth Headsets
• Notebook PCs
• Security and Surveillance

Key features

• 5 × 2.65 × 0.98 mm surface?mount package
• Low power: 215 µA in Low?Power Mode
• Extended frequency response from 40 Hz to >20 kHz
• Sleep Mode: 10 µA
• High power supply rejection (PSR): −91 dB FS
• Fourth?order Σ?Δ modulator
• Digital pulse density modulation (PDM) output
• Compatible with Sn/Pb and Pb?free solder processes
• RoHS/WEEE compliant

 

Key data

Product	T5808
Packaging Dimensions (mm)	3.50 × 2.65 × 0.98
SNR dBA	66
Acoutsic Overload Point dB SPL	135
Low Power Mode µA	215
Bandwidth kHz	20
Low Frequency Corner Hz	40
Digital Interface	SoundWire