ACM Research Enters Dry Processing Market with Launch of Ultra Furnace

By Tiera Oliver

Associate Editor

Embedded Computing Design

April 28, 2020

News

ACM Research Enters Dry Processing Market with Launch of Ultra Furnace

The Ultra Furnace system is intended for batch processing of up to 100 12-inch (300mm) wafers.

ACM Research, Inc. (ACMR), a supplier of wafer cleaning technologies for advanced semiconductor devices, unveiled the Ultra Furnace, its first system developed for multiple dry processing applications. Designed to deliver high performance for low-pressure chemical vapor deposition (LPCVD), the Ultra Furnace also leverages the same platform to be used for oxidation and annealing processes, as well as for atomic layer deposition (ALD). 

The Ultra Furnace system is intended for batch processing of up to 100 12-inch (300mm) wafers. According to the company, the system design combines newly developed hardware that improves durability with the company’s software technology and a proprietary control system and algorithm. This enables the tool to provide stable control of pressure, gas flow rate and temperature.

While the Ultra Furnace system targets LPCVD processes, with a few changes to the components and layout, each tool can address other target applications. According to the company, about 85 percent of the hardware configuration remains unchanged, so the alterations for the new application can be achieved.

For more information, visit: http://www.acmrcsh.com/

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Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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