KEMET Extends KC-LINK Range Using KONNEKT High-Density Packaging Technology
June 02, 2020
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical.
KEMET extended its KC-LINK range using KONNEKT high-density packaging technology for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications.
This technology combines KC-LINK’s C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor, according to the company.
High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides low effective series inductance (ESL), increasing the operating frequency range and allowing for further miniaturization. Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS, and REACH compliant. Capacitors utilizing KONNEKT technology have the ability to be mounted in a low-loss orientation to increase their power handling capability further.
Combining KEMET’s C0G dielectric system with KONNEKT technology offers a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling.
KEMET’s KC-LINK range with KONNEKT technology is available immediately via KEMET distributors. To learn more about KC-LINK with KONNEKT technology capabilities and applications, visit: https://www.kemet.com/en/us.html