Advanced Thermal Solutions Releases Heat Sinks for High Component Density PCBs

By Perry Cohen

Associate Editor

Embedded Computing Design

November 13, 2019


Advanced Thermal Solutions has released a series of heat sinks for cooling high powered CPUs, GPUs, FPGAs, and AI processors.

Advanced Thermal Solutions has released a series of  heat sinks for cooling high powered CPUs, GPUs, FPGAs, and AI processors. This ultra-cool family includes active heat sinks with integral blowers, and passive heat sinks that use available airflow to provide thermal management.

The active heat sinks, dualFLOW and quadFLOW, are designed for use on moderate to high component density PCBs, including 1U and 2U boards.

Depending on the sink, an aluminum or copper straight fin will be set at the base with a blower on top. The fast moving, high volume air helps maximize thermal performance on crowded boards and tight enclosures with insufficient airflow for passive cooling

The passive, or fanless, cooling solutions in ATS’ ultra-cool family are straight-fin heat sinks. They come in aluminum or nickel-plated copper depending on thermal performance and weight requirements. They are for use on systems with open airflow from front to back. Aluminum fins reduce the overall weight, while copper fins spread heat more efficiently for better thermal performance.

ATS ultra-cool heat sinks fit standard Intel LGA 2011 sockets (Socket R) square and LGA 2066 sockets (Socket R4) commonly used in high-end cloud and edge server applications. An optional backing plate is available for applications other than the Intel LGA 2011 socket.

 The heat sinks can be attached using PEM screws and springs that provide firm contact to the hot component for optimum heat dissipation. The dualFLOW and quadFLOW cooling devices are available with a vapor chamber base in place of an aluminum or copper heat sink base.

For more details on the ultra-cool sinks please visit