Industrial AI & Machine Lear1ing
 
Taking the ?Top? off TOPS in Inferencing Engines
GEOFF TATE, FLEX LOGIX, INC.
With the explosive growth of AI, there has become an intense focus on new specialized inferencing engines that can deliver the performance that AI demands. As a result, we?ve seen a continual array of neural inferencing hardware announcements over the last six months, all promising to deliver better acceleration than anything else on the market.
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Artificial intelligence and machine learning are reshaping the way we live through the advent of automated and autonomous vehicles, smart cities, smart factories and much more. Modern technologies are enabling increased automation across multiple markets with the help of rugged, robust, reliable systems from Crystal Group.
 
 
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Embedded Computing Design recently conducted targeted industry research on the prevalence of machine learning and artificial intelligence in the development community. Much to our surprise, more than 75 percent of the respondents are already researching or using AI in one capacity or another.
 
 
 
 
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The DSP revolutionized the field of signal processing back in the 1980s by reducing noise, improving accuracy, and easing programming for engineers working with analog signals. Over the next few decades, DSPs advanced to provide greater performance, floating-point computation, and extreme optimization for specific types of workloads.
 
 
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One of my favorite ?under the radar? companies is Socionext. I?m continually impressed by the company?s technology, and that was again the case at the recent CES show in Las Vegas. The company specializes in image processing products and recently partnered with DeepVision, a vision-based machine-learning vendor.
 
 
 
 
NEWS
 
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Nanotron Technologies GmbH and Schaeffler Technologies AG & Co. have completed a three-and-a-half-year collaborative project, FreiForm, developing compact, intelligent, autonomous sensors, also known as 'smart Items,' of any shape or form.
 
 
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Yole
LYON, France. A report by Yole Development suggests that 2.5D and 3D Through-Silicon Via (TSV) technology is being driven by applications such as artificial intelligence and high-performance computing (HPC).
 
 
 
 
 
 
Sponsored by: RTI
Date: February 27, 2019 2:00 p.m. ET
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