Embedded Computing Design

Industry News - Page 106

Analog & Power
GaN-based 500W Heatsinkless Audio Amplifier from Axign and GaN Systems

Tiera Oliver

January 6, 2022

Security
Image Courtesy of Blackberry QNX
BlackBerry Jarvis to Assist Developers with Executive Order 14028

Chad Cox

January 6, 2022

AI & Machine Learning
CEVA Announces NeuPro-M Heterogeneous and Secure Processor Architecture

Tiera Oliver

January 6, 2022

AI & Machine Learning
Avalanche Computing Launches Low-Code AI Tool at CES 2022

Taryn Engmark

January 5, 2022

Industrial
Blickfeld Announces Smart 3D LiDAR Alongside Launch of Percept Software

Tiera Oliver

January 5, 2022

Networking & 5G
Image Courtesy of Movandi
5G mmWave Phased Array Antenna Modules from Movandi and Doosan

Chad Cox

January 5, 2022

Automotive
(Image Courtesy of MORAI)
MORAI to Unveil Cloud-Based Autonomous Driving Simulation Technology at CES 2022

Tiera Oliver

January 5, 2022

Automotive
ACEINNA INS401 Inertial Navigation System and GNSS/RTK Turnkey Solution for ADAS and Autonomous Vehicle Precise Positioning

Tiera Oliver

January 5, 2022

Consumer
Photo Courtesy of Guide Sensmart
Guide Sensmart Releases Consumer Grade Autofocus Thermal Camera for Smartphones

Chad Cox

January 5, 2022

Automotive
emotion3D and onsemi Collaborate on Driver and Occupant Monitoring System Reference Design

Tiera Oliver

January 5, 2022

Consumer
CY Vision Launches AR Technology for Windshields for Next-Generation Vehicles at CES 2022

Taryn Engmark

January 5, 2022

Automotive
Image Courtesy of Ansys
Ansys Highlights Simulation Solutions at CES 2022

Chad Cox

January 5, 2022

Automotive
Tropos Motors Starts Production on EVs Equipped with Panasonic OneConnect

Taryn Engmark

January 5, 2022

AI & Machine Learning
MicroAI Demonstrates Edge-Native AI at CES

Tiera Oliver

January 5, 2022

AI & Machine Learning
SensoryCloud.ai Launches Cloud-Based Voice and Vision AI Services

Tiera Oliver

January 5, 2022

AI & Machine Learning
Image Credit: DEEPX
DEEPX has AI Acceleration at COMPUTEX 2024

April 19, 2024

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Storage
Image Credit: ATP Electronics
Embedded World 2024: High-Endurance, Robust Cross-Temp Reliability 176-Layer Storage, DDR5-5600 Solutions Take Center Stage at ATP Electronics’ Exhibit

April 5, 2024

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Networking & 5G
Fibocom’s 5G Premium Smart Module SC171 Awarded Best in Show by Embedded Computing Design at Embedded World 2024

April 16, 2024

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Processing
The Evolution of Processor Cores, and Embedded World 2024

April 18, 2024

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