Embedded Computing Design

KANSAS CITY, KANSAS. Cirrus Link announced the IoT Bridge for Microsoft Azure, a Sparkplug-based software widget that converts OT data to IT data, connects standard MQTT Sparkplug data models to Azure Digital Twin, and updates data changes to Azure Data Explorer for time series data. The IoT Bridge enables the creation of factory or asset data models with Sparkplug templates and automattically connects the models to Azure to generate insights regardinng productivity, uptime, and cost — without requiring any additional coding.

3D printing, since its conception in the 1980s, has only rise in popularity across industry sectors. Using a computer-driven design, 3D printing layers bio-material, plastic, or composites to create physical renditions of three-dimensional objects. This technology has established a method of manufacturing high-quality objects that is more cost-effective, customizable, and faster than purchasing pre-made products from stores, while also reducing waste due to its use of raw materials.

SAN JOSE, CALIFORNIA. Intel recently announced its 13th Gen Intel® Core™ processor family with six unlocked desktop processors that feature up to 24 cores, 32 threads, and clock speeds of up to 5.8 GHz. The 13th Gen Intel Core desktop family will include 22 processors and over 125 partner system designs that developers can couple with the newest supportt for DDR5 memory support and existing support for DDR4 memory support to create custom setups.

The International Energy Agency, or IEA, estimates that 10 percent of global electricity consumption comes from building HVAC systems and fans. So, what’s the impact of those systems on climate change?

Mitsubishi Electric will be testing several of their CC-Link IE TSN-certified industrial automation devices at the next Industry IoT Consortium (IIC) Plugfest at the University of Stuttgart on September 26th-27th, 2022 as part of the Testbed on Time-Sensitive Networking (TSN). The IIC Plugfest TSN Testbed is designed to give infrastructure providers a chance to validate their solutions againstt IEEE 802.1, with a goal of validating interoperability between local stations and external vendor switches. to enable OT and IT convergence.

Paris, France. Eutelsat and Actility jointly annonced ThingPark Exchange, a platform that combines IoT data aggregated from over 20 on-ground and satellite LoRaWAN IoT networks. Eutelsat’s LoRaWAN-compatible Low Earth Orbit (LEO) service, based on a fleet of nano satellites, will provide an IoT space network that can partner with existing terrestrial LPWAN infrastructure without additional terrestrial gateways, thereby extending LPWA network coverage across the globe.

MUNICH. Rohde & Schwarz has become the first CTIA-authorized test and measurement supplier to deliver a working test system for 5G FR2 and high-frequency (e.g., 28GHz) multi-AoA certification. Based on the company’s TS8980 conformance test system, CMX500 5G tester, and ATS1800M mmWave (FR2) chamber, the system will conduct over the air (OTA) mmWave communications tests that enable device manufacturers and network operators in the U.S. to begin validating 5G devices.

THALWIL, SWITZERLAND. A new firmware update added support for SPARTN 2.0 and QZSS CLAS positioning augmentation on u-blox ZED-F9R-03B GNSS dead reckoning modules that now provide 3-6 cm-level accuracy within seconds.

5G provides up to 20Gbit/s peak data rates, 100x faster download speeds and network capacity, and 10x lower latency than 4G networks. But some of the most significant benefits of 5G networks are their abilities to support service-based architectures (SBAs) that tailor resources to specific use cases, in industry and the enterprise.

NVIDIA's next GTC conference will be hosted virtually on Sept. 19-22. It is set to feature a keynote address from Jensen Huang, NVIDIA's CEO and founder, on Tuesday, Sept. 20 at 8 a.m. PT; as well as over 200 sessions with global business and technology experts. You can register now for free. The keynote will also be available on demand after its premiere, no event registration required.

5G promises mobile network operators and their customers higher capacity and energy efficiency, faster speed, lower RAN latency, and massive connectivity potential. But these benefits are not without tradeoffs — namely in the form of skyrocketing mobile data traffic demands.

Renesas Electronics Corporation's RZ/A3UL group of microprocessors (MPU) enables a high-definition human-machine interface (HMI) and quick startup for applications that require high throughput and real-time capabilities.

High speed data transmission and requirements for low latency demand implementations of narrow RF multi-channel designs and low interference with coexisting bands, in accordance with WiFi 6E and WiFi 7 / IEEE802.11ax standards.

Antenova Ltd, an antenna and RF antenna for MsM and IoT manufacturer based in the U.K. expanded its range of miniature Surface Mount Designed (SMD) antennas and modules for GNSS applications with its new antenna, Agosti. Part number SR4G080, Agosti measures 9.0 x 5.8 x 1.7 mm and efficiently operates in a smaller space on a PCB corner.

Object Management Group® (OMG®), an international technology standards organization, announced parts 1 and 2 of its Unified Architecture Framework® (UAF®) are now International Standards Organization/International Electrotechnical Commission (ISO/IEC) standards.

Viavi Solutions Inc.'s (VIAVI) 6G Forward program aims to provide expertise, technology, and funding to research that could culminate in advancements toward wireless technology's next generation. Northeastern University and the University of Texas at Austin in the US, as well as the UK's University of Surrey have already received such support from VIAVI.

STMicroelectroncs' STEVAL-ASTRA1B multi-connectivity evaluation platform is a complete, small form factor, battery-powered ecosystem for building complete proof-of-concept for asset tracking systems. This evaluation kit's included firmware simplifies development-targeted applications like fleet management and logistics.

The MIPI Alliance, an international mobile interface specifications organization, updated its application-agnostic MIPI UniPro transport layer for chip-to-chip/interprocessor communication (IPC) applications in traditional and modular device architectures. Version 2.0 includes features that double the data rate, while improving throughput and decreasing latency. 

Spirent Communications plc, a provider of test and assurance solutions for next-generation devices and networks, launched a “Send Us Your Device” Test as a Service (TaaS) option for Wi-Fi customers.

STMicroelectronics, a global semiconductor company, released version 4.20 of its TouchGFX user interface design software for STM32 microcontrollers. Updates in this version enable support for the company's NeoChrom graphics accelerator, integrated in ST's advanced MCUs.