SEMI Releases 2019 Heterogeneous Integration Roadmap
October 15, 2019
HIR provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions.
SEMI announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Designed to stimulate pre-competitive collaboration in order to advance heterogenous integration technology development and accelerate electronics innovation, HIR provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. SEMI is among five HIR sponsors.
The HIR offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of heterogeneous integration technology requirements to spur collaboration over the next 15 years. In addition, the HIR delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research and development timelines. The 2019 edition of the Heterogeneous Integration Roadmap includes 22 chapters and can be downloaded by visiting the SEMI HIR webpage. Chapters currently under peer review will be made available upon final approval.
The HIR is sponsored by the IEEE Electronics Packaging Society (EPS), SEMI, the IEEE Electron Devices Society (EDS), the IEEE Photonics Society and The American Society of Mechanical Engineers (ASME EPPD Division). Stakeholders interested in contributing to the 2020 HIR can join the effort by visiting the roadmap’s member page.
Learn more at www.semi.org.
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