Samsung Foundry Certifies Analog FastSPICE Platform from Siemens
January 22, 2021
News
Siemens announced that its verification of AMS circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.
The GAA is engineered to reduce total silicon size, use less power, and improve performance.
The certification allows customers to verify early-stage AMS designs by using the Analog FastSPICE (AFS) platform.
Per a company press release, the AFS platform is now enabled in Samsung Foundry’s device models and design kits. The AFS platform delivers nanometer-scale SPICE accuracy while verifying analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits faster than with traditional SPICE simulators.
For more information, visit www.sw.siemens.com.
Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation, podcast production, and social media efforts. Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university.
